AlxGa(1-x)As Substrate, Epitaxial Wafer for Infrared LEDs, Infrared LED, Method of Manufacturing AlxGa(1-x)As Substrate, Method of Manufacturing Epitaxial Wafer for Infrared LEDs, and Method of Manufacturing Infrared LEDs

ABSTRACT

Affords Al x Ga (1-x) As (0≦x≦1) substrates, epitaxial wafers for infrared LEDs, infrared LEDs, methods of manufacturing Al x Ga (1-x) As substrates, methods of manufacturing epitaxial wafers for infrared LEDs, and methods of manufacturing infrared LEDs, whereby a high level of transmissivity is maintained, and through which, in the fabrication of semiconductor devices, the devices prove to have superior characteristics. An Al x Ga (1-x) As substrate ( 10   a ) of the present invention is an Al x Ga (1-x) As substrate ( 10   a ) furnished with an Al x Ga (1-x) As layer ( 11 ) having a major surface ( 11   a ) and, on the reverse side from the major surface ( 11   a ), a rear face ( 11   b ), and is characterized in that in the Al x Ga (1-x) As layer ( 11 ), the amount fraction x of Al in the rear face ( 11   b ) is greater than the amount fraction x of Al in the major surface ( 11   a ). In addition, the Al x Ga (1-x) As substrate ( 10   a ) is further furnished with a GaAs substrate ( 13 ), contacting the rear face ( 11   b ) of the Al x Ga (1-x) As layer ( 11 ).

TECHNICAL FIELD

The present invention relates to Al_(x)Ga_((1-x))As substrates, to epitaxial wafers for infrared LEDs, and to infrared LEDs, and to methods of manufacturing Al_(x)Ga_((1-x))As substrates, methods of manufacturing epitaxial wafers for infrared LEDs, and methods of manufacturing infrared LEDs.

BACKGROUND ART

LEDs (light-emitting diodes) exploiting Al_(x)Ga_((1-x))As (0≦x≦1)—hereinafter also referred to as “AlGaAs” (aluminum gallium arsenide)—compound semiconductors are widely employed as infrared light sources. Infrared LEDs as infrared light sources are employed in such applications as optical communications and wireless transmission, wherein along with the scaling-up of transmitted data volume and the trend to longer-range transmission distances have come demands for improved output power from the infrared LEDs.

An example of a method of manufacturing such infrared LEDs is disclosed in Japanese Unexamined Pat. App. Pub. No. 2002-335008 (Patent Reference 1). The implementation of the following process steps is set forth in this Patent Reference 1. Specifically, to begin with an Al_(x)Ga_((1-x))As support substrate is formed onto a GaAs (gallium arsenide) substrate by liquid-phase epitaxy (LPE). At that point, the amount fraction of Al (aluminum) in the Al_(x)Ga_((1-x))As support substrate is approximately uniform. Subsequently, epitaxial layers are formed by organometallic vapor-phase epitaxy (OMVPE) or molecular beam epitaxy (MBE).

CITATION LIST Patent Literature

PTL 1: Japanese Unexamined Pat. App. Pub. No. 2002-335008

SUMMARY OF INVENTION Technical Problem

In the above-noted Patent Reference 1, the amount fraction of Al in the Al_(x)Ga_((1-x))As support substrate is for the most part uniform. As a result of dedicated research efforts, the present inventors discovered a problem with instances in which the Al amount fraction is high, in that the properties of infrared LEDs manufactured employing such Al_(x)Ga_((1-x))As support substrates deteriorate. As a further result of their dedicated research efforts, the present inventors also discovered a problem with instances in which the Al amount fraction is low, in that the transmissivity of the Al_(x)Ga_((1-x))As support substrates is poor.

Therein, an object of the present invention is to make available Al_(x)Ga_((1-x))As substrates, epitaxial wafers for infrared LEDs, infrared LEDs, methods of manufacturing Al_(x)Ga_((1-x))As substrates, methods of manufacturing epitaxial wafers for infrared LEDs, and methods of manufacturing infrared LEDs, whereby a high level of transmissivity is maintained, and through which, in the fabrication of semiconductor devices, the devices prove to have superior characteristics.

Solution to Problem

As a result of their especially focused research efforts, the present inventors not only found that the properties of infrared LEDs manufactured employing the Al_(x)Ga_((1-x))As support substrates are compromised when the Al amount fraction is high, but they also discovered the cause of the problem. Namely, aluminum has a propensity to oxidize readily, on account of which an oxide layer is liable to form on the surface of an Al_(x)Ga_((1-x))As substrate. Since the oxide layer impairs epitaxial layers grown onto the Al_(x)Ga_((1-x))As substrate, it proves to be a causative factor whereby defects are introduced into the epitaxial layers. The problem with defects introduced into epitaxial layers is that they are deleterious to the properties of infrared LEDs comprising the epitaxial layers.

Meanwhile, the present inventor's research efforts also led them to discover that the transmissivity of Al_(x)Ga_((1-x))As substrates worsens the lower is the substrates' amount fraction of Al.

Therein, an Al_(x)Ga_((1-x))As substrate of the present invention is an Al_(x)Ga_((1-x))As substrate furnished with an Al_(x)Ga_((1-x))As layer (0≦x≦1) having a major surface and, on the reverse side from the major surface, a rear face, and is characterized in that in the Al_(x)Ga_((1-x))As layer, the amount fraction x of Al in the rear face is greater than the amount fraction x of Al in the major surface.

In the just-described Al_(x)Ga_((1-x))As substrate, the Al_(x)Ga_((1-x))As layer preferably contains a plurality of laminae, and the amount fraction x of Al in each of the plural laminae monotonically decreases heading from the plane of the layer's rear-face side to the plane of its major-surface side.

For the just-described Al_(x)Ga_((1-x))As substrate, a GaAs substrate preferably is further furnished, contacting the rear face of the Al_(x)Ga_((1-x))As layer.

An infrared-LED epitaxial wafer of the present invention in one aspect is furnished with an Al_(x)Ga_((1-x))As substrate as set forth in any of the foregoing descriptions, and an epitaxial layer formed onto the major surface of the Al_(x)Ga_((1-x))As layer, and including an active layer.

In the infrared-LED epitaxial wafer of the one aspect just described, preferably the amount fraction x of Al in the plane of epitaxial layer contact with the Al_(x)Ga_((1-x))As layer is greater than the amount fraction x of Al in the plane of Al_(x)Ga_((1-x))As layer contact with the epitaxial layer.

An infrared LED of the present invention in one aspect is furnished with: an Al_(x)Ga_((1-x))As substrate set forth in any of the foregoing descriptions; an epitaxial layer; a first electrode; and a second electrode. The epitaxial layer is formed onto the major surface of the Al_(x)Ga_((1-x))As layer, and includes an active layer. The first electrode is formed on the surface of the epitaxial layer. The second electrode is formed on the rear face of the Al_(x)Ga_((1-x))As layer. In Al_(x)Ga_((1-x))As substrates of a form furnished with a GaAs substrate, the second electrode may be formed on the rear face of the GaAs substrate.

An infrared-LED epitaxial wafer of the present invention in another aspect is furnished with: an Al_(x)Ga_((1-x))As substrate that is not furnished with the aforementioned GaAs substrate; an epitaxial layer formed onto the major surface of the Al_(x)Ga_((1-x))As layer, and including an active layer; a cement layer formed onto a major surface of the epitaxial layer, on the reverse side thereof from its plane of contact with the Al_(x)Ga_((1-x))As layer; and a support substrate joined, via the cement layer, to the major surface of the epitaxial layer.

In the infrared-LED epitaxial wafer of said other aspect, preferably the cement layer and the support substrate are materials that are electroconductive.

In the infrared-LED epitaxial wafer of the just-described other aspect, preferably the support substrate is constituted from matter containing at least one substance selected from the group consisting of silicon, gallium arsenide, and silicon carbide.

In the infrared-LED epitaxial wafer of the foregoing other aspect, preferably an electroconductive layer and a reflective layer, formed in between the cement layer and the epitaxial layer, are further provided, with the electroconductive layer being transparent with respect to the light that the active layer emits, and the reflective layer being made from a metallic material that reflects light.

In the infrared-LED epitaxial wafer of the aforedescribed other aspect, preferably the electroconductive layer is constituted from matter containing at least one substance selected from the group consisting of mixtures of indium oxide and tin oxide, zinc oxide containing aluminum atoms, tin oxide containing fluorine atoms, zinc oxide, zinc selenide, and gallium oxide.

In the infrared-LED epitaxial wafer of the foregoing other aspect, preferably the reflective layer is constituted from matter containing at least one substance selected from the group consisting of aluminum, gold, platinum, silver, copper, chrome, and palladium.

In the infrared-LED epitaxial wafer of said other aspect, preferably the cement layer is adhesive with respect to the epitaxial layer and the support substrate, and is a transparent adhesive material that transmits the light that the active layer emits.

In the infrared-LED epitaxial wafer of the aforedescribed other aspect, preferably the cement layer is constituted from matter containing at least one substance selected from the group consisting of polyimide resins, epoxy resins, silicone resins, and perfluoro cyclobutane.

In the infrared-LED epitaxial wafer of said other aspect, preferably the support substrate is a transparent baseplate that transmits the light that the active layer emits.

In the infrared-LED epitaxial wafer of the foregoing other aspect, preferably the support substrate is constituted from matter containing at least one substance selected from the group consisting of sapphire, gallium phosphide, quartz and spinel.

An infrared LED of the present invention in a different aspect thereof is furnished with: an epitaxial wafer of the other aspect; a first electrode formed on the Al_(x)Ga_((1-x))As substrate; and a second electrode formed on either the support substrate or the epitaxial layer.

An Al_(x)Ga_((1-x))As substrate manufacturing method of the present invention is provided with a step of preparing a GaAs substrate, and a step of growing, by liquid-phase epitaxy, onto the GaAs substrate an Al_(x)Ga_((1-x))As layer (0≦x≦1) having a major surface. Then, in the step of growing a Al_(x)Ga_((1-x))As layer, the Al_(x)Ga_((1-x))As layer is grown with the amount fraction x of Al in the interface between the layer and the GaAs substrate being greater than the amount fraction x of Al in the major surface.

With the Al_(x)Ga_((1-x))As substrate manufacturing method, in the Al_(x)Ga_((1-x))As layer growing step, preferably the Al_(x)Ga_((1-x))As layer is grown containing a plurality of laminae in which the amount fraction x of Al monotonically decreases heading from the plane along the layer's interface with the GaAs substrate to the plane of the layer's major-surface side.

With the Al_(x)Ga_((1-x))As substrate manufacturing method described above, preferably a step of removing the GaAs substrate is further provided.

A method, of the present invention in one aspect thereof, of manufacturing an infrared-LED epitaxial wafer is provided with: a step of manufacturing an Al_(x)Ga_((1-x))As substrate by an Al_(x)Ga_((1-x))As substrate manufacturing method set forth in any of the foregoing descriptions; and a step of forming onto the major surface of the Al_(x)Ga_((1-x))As layer, by at least either OMVPE or MBE, or else by a combination of the two techniques, an epitaxial layer containing an active layer.

With the infrared-LED epitaxial wafer manufacturing method in the above-described one aspect, preferably the amount fraction x of Al in the plane of epitaxial layer contact with the Al_(x)Ga_((1-x))As layer is greater than the amount fraction x of Al in the plane of Al_(x)Ga_((1-x))As layer contact with the epitaxial layer.

A method, of the present invention in one aspect thereof, of manufacturing an infrared LED is provided with: a step of manufacturing an Al_(x)Ga_((1-x))As substrate by an Al_(x)Ga_((1-x))As substrate manufacturing method as set forth in any of the foregoing descriptions; a step of forming onto the major surface of the Al_(x)Ga_((1-x))As layer, by either OMVPE or MBE, an epitaxial layer containing an active layer, to yield an epitaxial wafer; a step of forming a first electrode on the front side of the epitaxial wafer; and a step of forming a second electrode on either the rear face of the Al_(x)Ga_((1-x))As layer, or the rear face of the GaAs substrate (in Al_(x)Ga_((1-x))As substrates of a form furnished with a GaAs substrate).

A method, of the present invention in another aspect thereof, of manufacturing an infrared-LED epitaxial wafer is provided with: a step of manufacturing an Al_(x)Ga_((1-x))As substrate by an Al_(x)Ga_((1-x))As substrate manufacturing method in which the above-described GaAs substrate is not furnished; a step of forming onto the major surface of the Al_(x)Ga_((1-x))As layer, by at least either OMVPE or MBE, an epitaxial layer containing an active layer; a step of bonding, via a cement layer, a major surface of the epitaxial layer, on the reverse side thereof from its plane of contact with the Al_(x)Ga_((1-x))As layer, together with a support substrate; and a step of removing the GaAs substrate.

In the infrared-LED epitaxial wafer manufacturing method of the present invention in this other aspect, preferably the cement layer and the support substrate are materials that are electroconductive.

In the infrared-LED epitaxial wafer manufacturing method of the present invention in this other aspect, preferably the support substrate is constituted from matter containing at least one substance selected from the group consisting of silicon, gallium arsenide, and silicon carbide.

In the infrared-LED epitaxial wafer manufacturing method of the present invention in the other aspect, preferably an electroconductive layer and a reflective layer, formed in between the cement layer and the epitaxial layer, are further provided, with the electroconductive layer being transparent with respect to the light that the active layer emits, and the reflective layer being made from a metallic material that reflects light.

With the method, of the present invention in this other aspect thereof, of manufacturing an epitaxial wafer for infrared LEDs, preferably the electroconductive layer is constituted from matter containing at least one substance selected from the group consisting of mixtures of indium oxide and tin oxide, zinc oxide containing aluminum atoms, tin oxide containing fluorine atoms, zinc oxide, zinc selenide, and gallium oxide.

With the method, of the present invention in this other aspect thereof, of manufacturing an epitaxial wafer for infrared LEDs, preferably the reflective layer is constituted from matter containing at least one substance selected from the group consisting of aluminum, gold, platinum, silver, copper, chrome, and palladium.

In the infrared-LED epitaxial wafer manufacturing method of the present invention in this other aspect, preferably the cement layer is adhesive with respect to the epitaxial layer and the support substrate, and is a transparent adhesive material that transmits the light that the active layer emits.

With the method, of the present invention in this other aspect thereof, of manufacturing an epitaxial wafer for infrared LEDs, preferably the cement layer is constituted from matter containing at least one substance selected from the group consisting of polyimide resins, epoxy resins, silicone resins, and perfluorocyclobutane.

In the infrared-LED epitaxial wafer manufacturing method of the present invention in this other aspect, preferably the support substrate is a transparent baseplate that transmits the light that the active layer emits.

With the method, of the present invention in this other aspect thereof, of manufacturing an epitaxial wafer for infrared LEDs, preferably the support substrate is constituted from matter containing at least one substance selected from the group consisting of sapphire, gallium phosphide, quartz and spinel.

An infrared LED of the present invention in a different aspect thereof is furnished with: a step of manufacturing an epitaxial wafer by an epitaxial wafer manufacturing method in the other aspect; a step of forming a first electrode on the Al_(x)Ga_((1-x))As substrate; and a step of forming a second electrode on either the support substrate or the epitaxial layer.

ADVANTAGEOUS EFFECTS OF INVENTION

Al_(x)Ga_((1-x))As substrates, epitaxial wafers for infrared LEDs, infrared LEDs, methods of manufacturing Al_(x)Ga_((1-x))As substrates, methods of manufacturing epitaxial wafers for infrared LEDs, and methods of manufacturing infrared LEDs of the present invention, allow a high level of transmissivity to be maintained, and when semiconductor devices are fabricated, make for devices having superior characteristics.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a sectional diagram illustratively outlining an Al_(x)Ga_((1-x))As substrate in Embodying Mode 1 of the present invention.

FIG. 2 is a chart for explaining the amount fraction x of Al in an Al_(x)Ga_((1-x))As layer in Embodying Mode 1 of the present invention.

FIG. 3 is a chart for explaining the amount fraction x of Al in an Al_(x)Ga_((1-x))As layer in Embodying Mode 1 of the present invention.

FIG. 4 is a chart for explaining the amount fraction x of Al in an Al_(x)Ga_((1-x))As layer in Embodying Mode 1 of the present invention.

FIGS. 5 (A) through (G) are charts for explaining the amount fraction x of Al in an Al_(x)Ga_((1-x))As layer in Embodying Mode 1 of the present invention.

FIG. 6 is a flowchart representing a method of manufacturing an Al_(x)Ga_((1-x))As substrate in Embodying Mode 1 of the present invention.

FIG. 7 is a sectional diagram illustratively outlining a GaAs substrate in Embodying Mode 1 of the present invention.

FIG. 8 is a sectional diagram illustratively outlining an as-grown Al_(x)Ga_((1-x))As layer in Embodying Mode 1 of the present invention.

FIGS. 9 (A) through (C) are charts for explaining the effect, in Embodying Mode 1 of the present invention, of furnishing an Al_(x)Ga_((1-x))As layer with a plurality of lamina in which the amount fraction x of Al monotonically decreases.

FIG. 10 is a sectional diagram illustratively outlining an Al_(x)Ga_((1-x))As substrate in Embodying Mode 2 of the present invention.

FIG. 11 is a flowchart representing a method of manufacturing an Al_(x)Ga_((1-x))As substrate in Embodying Mode 2 of the present invention.

FIG. 12 is a sectional diagram illustratively outlining an infrared-LED epitaxial wafer in Embodying Mode 3 of the present invention.

FIG. 13 is an enlarged sectional diagram illustratively outlining an active layer in Embodying Mode 3 of the present invention.

FIG. 14 is a flowchart representing a method of manufacturing an infrared-LED epitaxial wafer in Embodying Mode 3 of the present invention.

FIG. 15 is a sectional diagram illustratively outlining an infrared-LED epitaxial wafer in Embodying Mode 4 of the present invention.

FIG. 16 is a flowchart representing a method of manufacturing an epitaxial wafer in Embodying Mode 4 of the present invention.

FIG. 17 is a sectional diagram illustratively outlining an infrared-LED epitaxial wafer in Embodying Mode 5 of the present invention.

FIG. 18 is a sectional diagram illustratively outlining an infrared LED in Embodying Mode 6 of the present invention.

FIG. 19 is a flowchart representing a method of manufacturing an infrared LED in Embodying Mode 6 of the present invention.

FIG. 20 is a sectional diagram illustratively outlining an infrared LED in Embodying Mode 7 of the present invention.

FIG. 21 is a graph plotting transmissivity versus amount fraction x of Al in Al_(x)Ga_((1-x))As layers of Embodiment 1.

FIG. 22 is a graph plotting surface oxygen quantity versus amount fraction x of Al in Al_(x)Ga_((1-x))As layers of Embodiment 1.

FIG. 23 is a sectional diagram illustratively outlining an infrared-LED epitaxial wafer in Embodiment 3.

FIG. 24 is a chart diagramming light output, in Embodiment 3, from an infrared-LED epitaxial wafer furnished with an active layer having multiquantum-well structures, and from an epitaxial wafer for double-heterostructure infrared LEDs.

FIG. 25 is a sectional diagram illustratively outlining an infrared-LED epitaxial wafer in Embodiment 4.

FIG. 26 is a chart diagramming the relationship between window-layer thickness and light output power in Embodiment 4.

FIG. 27 is a sectional diagram illustratively outlining a modified example of an infrared LED in Embodying Mode 7 of the present invention.

FIG. 28 is a sectional diagram illustratively outlining an infrared-LED epitaxial wafer in Embodying Mode 8 of the present invention.

FIG. 29 is a flowchart representing a method of manufacturing an infrared-LED epitaxial wafer in Embodying Mode 8 of the present invention.

FIG. 30 is a sectional diagram illustratively outlining a situation in which the support substrate in Embodying Mode 8 of the present invention has been cemented.

FIG. 31 is a sectional diagram illustratively outlining an infrared-LED epitaxial wafer in Embodying Mode 9 of the present invention.

FIG. 32 is a sectional diagram illustratively outlining a situation in which the support substrate in Embodying Mode 9 of the present invention has been cemented.

FIG. 33 is a sectional diagram illustratively outlining an infrared-LED epitaxial wafer in Embodying Mode 10 of the present invention.

FIG. 34 is a sectional diagram illustratively outlining a situation in which the support substrate in Embodying Mode 10 of the present invention has been cemented.

FIG. 35 is a sectional diagram illustratively outlining an infrared LED in Embodying Mode 11 of the present invention.

FIG. 36 is a sectional diagram illustratively outlining an infrared LED in Embodying Mode 12 of the present invention.

FIG. 37 is a sectional diagram illustratively outlining an infrared LED in Embodying Mode 13 of the present invention.

FIG. 38 is a chart plotting the results of measuring the emission wavelength from an infrared LED in Embodiment 6.

DESCRIPTION OF EMBODIMENTS

In the following, an explanation based on the drawings will be made of modes of embodying the present invention.

Embodying Mode 1

To begin with, referring to FIG. 1, an explanation of an Al_(x)Ga_((1-x))As substrate in the present embodying mode will be made.

As represented in FIG. 1, an Al_(x)Ga_((1-x))As substrate 10 a is furnished with a GaAs substrate 13, and an Al_(x)Ga_((1-x))As layer 11 formed onto the GaAs substrate 13.

The GaAs substrate 13 has a major surface 13 a, and a rear face 13 b on the reverse side from the major surface 13 a. The Al_(x)Ga_((1-x))As layer 11 has a major surface 11 a, and a rear face 11 b on the reverse side from the major surface 11 a.

The GaAs substrate 13 may or may not be misoriented—for example, it may have a major surface 13 a that is a {100} plane, or that is tilted more than 0° but 15.8° or less from a {100} plane. It is preferable that the GaAs substrate 13 have a major surface 13 a that is a {100} plane, or that is tilted more than 0° but 2° or less from a {100} plane. It is further preferable that the GaAs substrate 13 have a surface that is a {100} plane, or that is tilted more than 0° but 0.2° or less from a {100} plane. The GaAs substrate 13 surface may be a specular surface, or may be a rough surface. (It will be understood that the braces “{ }” indicate a family of planes.)

The Al_(x)Ga_((1-x))As layer 11 has a major surface 11 a and, on the reverse side from the major surface 11 a, a rear face 11 b. The major surface 11 a is the surface on the reverse side from the surface that contacts the GaAs substrate 13. The rear face 11 b is the surface that contacts the GaAs substrate 13.

The Al_(x)Ga_((1-x))As layer 11 is formed so as to contact on the major surface 13 a of the GaAs substrate 13. Put differently, the GaAs substrate 13 is formed as to contact on the rear face 11 b of the Al_(x)Ga_((1-x))As layer 11.

In the Al_(x)Ga_((1-x))As layer 11, the amount fraction x of Al in the rear face 11 b is greater than the amount fraction x of Al in the major surface 11 a. It should be understood that the amount fraction x is the mole fraction of Al, while the amount fraction (1−x) is the mole fraction of Ga.

Therein, the mole fractions in the Al_(x)Ga_((1-x))As layer 11 will be explained with reference to FIGS. 2 through 5.

In FIGS. 2 through 5, the vertical axis indicates position thickness-wise traversing from the rear face to the major surface of the Al_(x)Ga_((1-x))As layer 11, while the horizontal axis represents the Al amount fraction x in each position.

As shown in FIG. 2, with the Al_(x)Ga_((1-x))As layer 11, traversing from the rear face 11 b to the major surface 11 a, the amount fraction x of Al monotonically decreases. “Monotonically decreases” means that heading from the rear face 11 b to the major surface 11 a of the Al_(x)Ga_((1-x))As layer 11 (heading in the growth direction), the amount fraction x is constantly the same or decreasing, and that, compared with the rear face 11 b, the major surface 11 a is where the amount fraction x is lower.

Put differently, “monotonically decreases” would not include a section in which the amount fraction x increases heading in the growth direction.

As indicated in FIGS. 3 through 5, the Al_(x)Ga_((1-x))As layer 11 may include a plurality of laminae (in FIGS. 3 through 5, it includes two laminae). With the Al_(x)Ga_((1-x))As layer 11 represented in FIG. 3, traversing in each lamina from the rear face 11 b side to the major surface 11 a side, the amount fraction x of Al monotonically decreases. Meanwhile, with the Al_(x)Ga_((1-x))As layer 11 represented in FIG. 4, the amount fraction x of Al is uniform in each lamina, but the amount fraction x of Al in the lamina along the rear face 11 b is greater than in that along the major surface 11 a. On the other hand, the amount fraction x of Al in the lamina along the rear face 11 b of the Al_(x)Ga_((1-x))As layer 11 represented in FIG. 5A is uniform, while the amount fraction x of Al in the lamina along the major surface 11 a monotonically decreases, with the Al amount fraction x in the lamina along the rear face 11 b being greater than the Al amount fraction x along the major surface 11 a. In sum, with the Al_(x)Ga_((1-x))As layers 11 represented in FIGS. 4 and 5A, as a whole, the amount fraction x of Al monotonically decreases.

It should be understood that the amount fraction x of Al in the Al_(x)Ga_((1-x))As layer 11 is not limited to the foregoing, and the composition may be as indicated for example in FIGS. 5B-5G, or may be other examples as well. Also, the Al_(x)Ga_((1-x))As layer 11 is not limited to the above-described implementations containing one lamina or two laminae, but may contain three or more laminae, as long as the amount fraction x of Al in the rear face 11 b is greater than the amount fraction x of Al in the major surface 11 a.

When the Al_(x)Ga_((1-x))As substrate 10 a is utilized in an LED, the Al_(x)Ga_((1-x))As layer 11 assumes the role of, for example, a window layer that diffuses current and that transmits light from the active layer.

To continue: With reference to FIG. 6, an explanation of a method of manufacturing an Al_(x)Ga_((1-x))As substrate in the present embodying mode will be made.

As indicated in FIGS. 6 and 7, initially a GaAs substrate 13 is prepared (Step S1).

The GaAs substrate 13 may or may not be misoriented—for example, it may have a major surface 13 a that is a {100} plane, or that is tilted more than 0° but not more than 15.8° from a {100} plane. It is preferable that the GaAs substrate 13 have a major surface 13 a that is a {100} plane, or that is tilted more than 0° but not more than 2° from a {100} plane. It is further preferable that the GaAs substrate 13 have a major surface 13 a that is a {100} plane, or that is tilted more than 0° but not more than 0.2° from a {100} plane.

As indicated in FIGS. 6 and 8, next an Al_(x)Ga_((1-x))As layer (0≦x≦1) 11 having a major surface 11 a is grown by LPE onto the GaAs substrate 13 (Step S2).

By Step S2 of growing the Al_(x)Ga_((1-x))As layer 11, an Al_(x)Ga_((1-x))As layer 11 in which the amount fraction x of Al in the layer's interface with the GaAs substrate 13 (the rear face 11 b) is greater than the amount fraction x of Al in the major surface 11 a is grown.

The LPE technique is not particularly limited; a slow-cooling or temperature-profile technique can be employed. It should be understood that “LPE” refers to a method of growing Al_(x)Ga_((1-x))As (0≦x≦1) crystal from the liquid phase. A “slow-cooling” technique is a method of gradually lowering the temperature of a source-material solution to grow Al_(x)Ga_((1-x))As crystal. A “temperature-profile” technique refers to a method of setting up a temperature gradient in a source-material solution to grow Al_(x)Ga_((1-x))As crystal.

When a lamina with a fixed amount fraction x of Al in the Al_(x)Ga_((1-x))As layer 11 is to be grown, temperature-profile and slow-cooling techniques are preferably utilized, while when a lamina in which the amount fraction x of Al decreases heading upward (in the growth direction) is to be grown, slow-cooling is preferably utilized. Utilizing slow cooling is particularly preferable, because of its advantages in terms of volume produciblity and low cost. These techniques also may be combined.

With LPE, since a chemical equilibrium between the liquid and solid phases is exploited, the growth rate is rapid. On that account, an Al_(x)Ga_((1-x))As layer 11 of considerable thickness may be readily formed. Specifically, an Al_(x)Ga_((1-x))As layer 11 having a height H11 preferably of from 10 μm to 1000 um, more preferably from 20 μm to 140 μm is grown. (The height H11 in this case is the minimum thickness along the Al_(x)Ga_((1-x))As layer 11 thickness-wise.)

A further preferable condition is that the ratio of the height H11 of the Al_(x)Ga_((1-x))As layer 11 to the height H13 of the GaAs substrate 13 (H11/H13) be, for example, from 0.1 to 0.5, more preferably from 0.3 to 0.5. This conditional factor makes it possible to mitigate the incidence of warp in the Al_(x)Ga_((1-x))As layer 11 having been grown onto the GaAs substrate 13.

Furthermore, the Al_(x)Ga_((1-x))As layer 11 may be grown so as to incorporate p-type dopants such as zinc (Zn), magnesium (Mg) and carbon (C), and n-type dopants such as selenium (Se), sulfur (S) and tellurium (Te), for example.

In this way growing an Al_(x)Ga_((1-x))As layer 11 by LPE produces a jaggedness in the major surface 11 a of the Al_(x)Ga_((1-x))As layer 11, as indicated in FIG. 8.

Next, the major surface 11 a of the Al_(x)Ga_((1-x))As layer 11 is washed (Step S3). In Step S3, washing is preferably done using an alkali solution. However, an oxidizing solution such as phosphoric acid or sulfuric acid may also be employed. The alkali solution preferably contains ammonia and hydrogen peroxide. Washing the major surface 11 a with an alkali solution containing ammonia and hydrogen peroxide etches the surface, whereby impurities clinging to the major surface 11 a from having been in contact with air may be removed. By controlling the process so that, for example, with an etching rate of 0.2 μm/min or less, not more than 0.2 μm is etched from the major surface 11 a side, impurities on the major surface 11 a are reduced and at the same time the extent of etching will be slight. It should be noted that Step S3 of washing the major surface 11 a may be omitted.

Next, the GaAs substrate 13 and the Al_(x)Ga_((1-x))As layer 11 are dried with alcohol. This step of drying may be omitted, however.

Next, the major surface 11 a of the Al_(x)Ga_((1-x))As layer 11 is polished (Step S4).

The method of polishing is not particularly limited; mechanical polishing, chemical-mechanical polishing, electrolytic polishing, or chemical polishing techniques may be employed, while in terms of polishing ease, mechanical polishing or chemical polishing are preferable.

The major surface 11 a is polished so that the RMS roughness of the major surface 11 a will be, for example, 0.05 nm or less. The RMS surface roughness is preferably minimal. Here, “RMS roughness” signifies a surface's mean-square roughness, as defined by JIS B0601—that is, the square root of the averaged value of the squares of the distance (deviation) from an averaging plane to a measuring plane. It should be noted that this polishing Step S4 may be omitted.

Next, the major surface 11 a of the Al_(x)Ga_((1-x))As layer 11 is washed (Step S5). Inasmuch as this Step 5 of washing the major surface 11 a is the same as Step 3 of washing the major surface 11 a prior to implementing polishing Step 4, explanation of the step will not be repeated. It should be noted that this washing Step S5 may be omitted.

Next, the GaAs substrate 13 and the Al_(x)Ga_((1-x))As layer 11 are, by utilizing the Al_(x)Ga_((1-x))As substrate 10 a, thermally cleaned in an H₂ (hydrogen) and AsH₃ (arsine) flow prior to epitaxial growth. It should be understood that this thermal cleaning step may be omitted.

Implementing the foregoing Steps S1 through S5 enables the manufacture of an Al_(x)Ga_((1-x))As substrate 10 a in the present embodying mode, represented in FIG. 1.

As described in the foregoing, an Al_(x)Ga_((1-x))As substrate 10 a in the present embodying mode is an Al_(x)Ga_((1-x))As substrate 10 a furnished with an Al_(x)Ga_((1-x))As layer 11 having a major surface 11 a and, on the reverse side from the major surface 11 a, a rear face 11 b, and is characterized in that in the Al_(x)Ga_((1-x))As layer 11, the amount fraction x of Al in the rear face 11 b is greater than the amount fraction x of Al in the major surface 11 a. Then further to this constitution a GaAs substrate 13 is provided, contacting the rear face 11 b of the Al_(x)Ga_((1-x))As layer 11.

In addition, a method of manufacturing an Al_(x)Ga_((1-x))As substrate 10 a in the present embodying mode is provided with a step (Step S1) of preparing a GaAs substrate 13, and a step (Step S2) of growing, by liquid-phase epitaxy, an Al_(x)Ga_((1-x))As layer 11 having a major surface 11 a onto the GaAs substrate 13. The method is characterized in that in the step of growing the Al_(x)Ga_((1-x))As layer 11 (Step S2), an Al_(x)Ga_((1-x))As layer 11 is grown in which the amount fraction x of Al in the interface between the layer and the GaAs substrate 13 (in the rear face 11 b) is greater than the amount fraction x of Al in the major surface 11 a.

According to an Al_(x)Ga_((1-x))As substrate 10 a and a method of manufacturing an Al_(x)Ga_((1-x))As substrate 10 a in the present embodying mode, the amount fraction x of Al in the rear face 11 b is greater than the amount fraction x of Al in the major surface 11 a. The presence of aluminum, which has a propensity to oxidize, on the major surface 11 a may therefore be kept to a minimum. And the formation of an oxide layer, which would act as an insulator, on the surface of the Al_(x)Ga_((1-x))As substrate 10 a (the major surface 11 a of the Al_(x)Ga_((1-x))As layer 11 in the present embodying mode) may therefore be restrained.

Especially since the Al_(x)Ga_((1-x))As layer 11 is grown by LPE, oxygen is unlikely to be taken into the layer-internal region, apart from the major surface 11 a. Accordingly, when epitaxial layers are grown onto the Al_(x)Ga_((1-x))As substrate 10 a, defects can be kept from being introduced into the epitaxial layers. The characteristics of an infrared LED furnished with the epitaxial layers can be improved as a result.

Again, the Al amount fraction x in the major surface 11 a is less than the Al amount fraction x in the rear face 11 b. The present inventor's intensive research efforts led them to discover that the greater the Al amount fraction x is, the better will the transmissivity of the Al_(x)Ga_((1-x))As substrate 10 a be. And even if the layer contains much aluminum along the rear face 11 b, because the period of time it is exposed on the surface is short, formation of any oxide layer may be minimized. Therefore, growing Al_(x)Ga_((1-x))As crystal of higher Al amount fraction x, with a portion where oxide-layer formation is minimized allows the transmissivity to be improved.

In this way, in the Al_(x)Ga_((1-x))As layer 11, the amount fraction x of Al along the major surface 11 a is made lower so as to improve the device characteristics, while the amount fraction x of Al along the rear face 11 b is made higher so as to improve the transmissivity. Hence, an Al_(x)Ga_((1-x))As substrate 10 a can be realized whereby a high level of transparency is maintained, and with which, when devices are fabricated, the devices prove to have superior characteristics.

In the Al_(x)Ga_((1-x))As substrate 10 a described above, preferably, as indicated in FIG. 3, the Al_(x)Ga_((1-x))As layer 11 contains a plurality of laminae, and the Al amount fraction x in each lamina monotonically decreases heading from the plane of the rear face 11 b side to the plane of the major surface 11 a side.

In the Al_(x)Ga_((1-x))As substrate 10 a manufacturing method described above, in the step of growing the Al_(x)Ga_((1-x))As layer 11 (Step S2), preferably an Al_(x)Ga_((1-x))As layer 11 is grown that contains a plurality of laminae in which the amount fraction x of Al monotonically decreases heading from the plane along the layer's interface with the GaAs substrate 13 (from the rear face 11 b) to the plane of the layer's major-surface 11 a side.

The present inventors discovered that this makes it possible to mitigate warp occurring in the Al_(x)Ga_((1-x))As substrate 10 a. Below, with reference to FIGS. 9A through 9C, an explanation will be made of the reasons why. FIG. 9A represents an instance, as indicated in FIG. 2, where the laminar section in which the Al amount fraction x in the Al_(x)Ga_((1-x))As layer 11 monotonically decreases is a single lamina. FIG. 9B represents an instance where in the Al_(x)Ga_((1-x))As layer 11 the laminar section in which the Al amount fraction x monotonically decreases as indicated in FIG. 3 is two laminae. FIG. 9C represents an instance where the laminar section in which the Al amount fraction x monotonically decreases in the Al_(x)Ga_((1-x))As layer 11 is three laminae.

In FIGS. 9A-9C the horizontal axis indicates position thickness-wise traversing from the rear face 11 b to the major surface 11 a of the Al_(x)Ga_((1-x))As layer 11, while the vertical axis represents the Al amount fraction x in each position in the Al_(x)Ga_((1-x))As layer 11. With the Al_(x)Ga_((1-x))As layers 11 represented in FIGS. 9A-9C, the amount fraction x of Al in the rear faces 11 b and in the major surfaces 11 a are the same.

In FIGS. 9A-9C, imaginary triangles are formed by a point of intersection (Point C) where, when the highest position (Point A) along the diagonal y representing the amount fraction x of Al is extended downward, and the lowest position (Point B) along the diagonal y is extended leftward, they intersect. The total surface area of these triangles is the stress that is applied to the Al_(x)Ga_((1-x))As layer 11. Warp occurs in the Al_(x)Ga_((1-x))As layer 11 on account of this stress.

The present inventors discovered that warp in the Al_(x)Ga_((1-x))As layer 11 is more likely to appear the greater is the separation z between the geometric center G of the triangles, and the center along the thickness of the Al_(x)Ga_((1-x))As layer 11. The geometric center G is, in the instance illustrated in FIG. 9A, the geometric center G of the triangle formed based on the diagonal y, while in the instances illustrated in FIGS. 9B and 9C, it is the center along a line joining the geometric centers G1 through G3 of triangles formed based on the diagonals y. The geometric center G is where the combined force of the stresses inside the Al_(x)Ga_((1-x))As layer 11 added together acts.

As indicated in FIGS. 9A-9C, the more the number of laminae in which the amount fraction x of Al monotonically decreases, the shorter becomes the separation z from the center along the thickness to the thickness point where the geometric center G is located, and thus the less warp occurs in the Al_(x)Ga_((1-x))As layer 11. Therefore, forming a plurality of laminae in which the amount fraction x of Al monotonically decreases mitigates warp in a Al_(x)Ga_((1-x))As substrate 10 a. Herein, with the several triangles in the figures, the maximum and minimum values of the amount fraction x of Al, and the thickness of the Al_(x)Ga_((1-x))As layer 11 are the same, but they do not necessarily have to be made the same: They are adjustable depending on such factors as the transmissivity, warp, and state of the interfaces.

Embodying Mode 2

Referring to FIG. 10, an explanation of an Al_(x)Ga_((1-x))As substrate 10 b in the present embodying mode will be made.

As represented in FIG. 10, an Al_(x)Ga_((1-x))As substrate 10 b in the present embodying mode is furnished with a structural makeup that basically is the same as that of an Al_(x)Ga_((1-x))As substrate 10 a of Embodying Mode 1, but differs in that it is not furnished with a GaAs substrate 13.

Specifically, the Al_(x)Ga_((1-x))As substrate 10 b is furnished with an Al_(x)Ga_((1-x))As layer 11 having a major surface 11 a and, on the reverse side from the major surface 11 a, a rear face 11 b. Then in the Al_(x)Ga_((1-x))As layer 11, the amount fraction x of Al in the rear face 11 b is greater than the amount fraction x of Al in the major surface 11 a.

It is preferable that the thickness of an Al_(x)Ga_((1-x))As layer 11 in the present embodying mode be thick enough for the Al_(x)Ga_((1-x))As substrate 10 b to be a freestanding substrate. Such height H11 is, for example, 70 μm or more.

To continue: With reference to FIG. 11, an explanation of a method of manufacturing an Al_(x)Ga_((1-x))As substrate 10 b in the present embodying mode will be made.

As indicated in FIG. 11, initially, in the same manner as in Embodying Mode 1, Step S1 of preparing a GaAs substrate 13, Step S2 of growing an Al_(x)Ga_((1-x))As layer 11 by LPE, washing Step S3, and polishing Step S4 are implemented. An Al_(x)Ga_((1-x))As substrate 10 a as represented in FIG. 1 is thereby manufactured.

Next, the GaAs substrate 13 is removed (Step S6). For the removal method, a technique such as polishing or etching, for example, can be employed. “Polishing” refers to employing a polishing agent such as alumina, colloidal silica, or diamond in grinding equipment such as is fitted with diamond grinding wheels, to mechanically abrade away the GaAs substrate 13. “Etching” refers to carrying out GaAs substrate 13 removal employing an etchant selected by optimally compounding, for example, ammonia, hydrogen peroxide, etc. to have a slow etching rate on Al_(x)Ga_((1-x))As, but a fast etching rate on GaAs.

Next, washing Step S5 is implemented in the same manner as in Embodying Mode 1.

Implementing the foregoing Steps S1, S2, S3, S4, S6, and S5 makes it possible to manufacture an Al_(x)Ga_((1-x))As substrate 10 b as represented in FIG. 10.

It should be understood that apart from that, the Al_(x)Ga_((1-x))As substrate 10 b and its method of manufacture are otherwise of the same constitution as the Al_(x)Ga_((1-x))As substrate 10 a, and its method of manufacture, in Embodying Mode 1; thus identical components are labeled with identical reference marks, and their explanation will not be repeated.

As described in the foregoing, the Al_(x)Ga_((1-x))As substrate 10 b in the present embodying mode is an Al_(x)Ga_((1-x))As substrate 10 b furnished with an Al_(x)Ga_((1-x))As layer 11 having a major surface 11 a and, on the reverse side from the major surface 11 a, a rear face 11 b, and is characterized in that in the Al_(x)Ga_((1-x))As layer 11, the amount fraction x of Al in the rear face 11 b is greater than the amount fraction x of Al in the major surface 11 a.

In addition, a method of manufacturing an Al_(x)Ga_((1-x))As substrate 10 b in the present embodying mode is further provided with a step (Step S6) of removing the GaAs substrate 13.

According to an Al_(x)Ga_((1-x))As substrate 10 b and a method of manufacturing an Al_(x)Ga_((1-x))As substrate 10 b in the present embodying mode, an Al_(x)Ga_((1-x))As substrate 10 b not furnished with a GaAs substrate 13, but furnished solely with an Al_(x)Ga_((1-x))As layer 11 may be realized. Since the GaAs substrate 13 absorbs light of 900 nm or less wavelength, growing epitaxial layers onto an Al_(x)Ga_((1-x))As substrate 10 b from which the GaAs substrate 13 has been removed enables the manufacture of epitaxial wafers for infrared LEDs. Employing such infrared-LED epitaxial wafers to manufacture infrared LEDs enables the realization of infrared LEDs in which a high level of transparency is maintained, and which have superior device characteristics.

Embodying Mode 3

Referring to FIG. 12, an explanation of an epitaxial wafer 20 a in the present embodying mode will be made.

As indicated in FIG. 12, the epitaxial wafer 20 a is furnished with an Al_(x)Ga_((1-x))As substrate 10 a, represented in FIG. 1, of Embodying Mode 1, and, formed onto the major surface 11 a of the Al_(x)Ga_((1-x))As layer 11, an epitaxial layer containing an active layer 21. That is, the epitaxial wafer 20 a is furnished with a GaAs substrate 13, an Al_(x)Ga_((1-x))As layer 11 formed onto the GaAs substrate 13, and, formed onto the Al_(x)Ga_((1-x))As layer 11, the epitaxial layer containing the active layer 21. The energy bandgap of the active layer 21 is smaller than that of the Al_(x)Ga_((1-x))As layer 11.

It is preferable that the amount fraction x of Al in the active layer 21 in its plane of contact with the Al_(x)Ga_((1-x))As layer 11 (in the active layer's rear face 21 c) be larger than the amount fraction x of Al in the Al_(x)Ga_((1-x))As layer 11 in its plane of contact with the active layer 21 (in the present embodying mode, in the layer's major surface 11 a). It is also preferable that the amount fraction x of Al in the lamina of greatest thickness in the epitaxial layer containing the active layer 21 be larger than the amount fraction x of Al in the Al_(x)Ga_((1-x))As layer 11 in its plane of contact with the active layer 21 (in the present embodying mode, in the layer's major surface 11 a). Such an implementation makes it possible to mitigate warp that occurs in the epitaxial wafer 20 a.

It is preferable that, as indicated in FIG. 13, the active layer 21 have a multiquantum-well structure.

The active layer 21 contains two or more well layers 21 a. The well layers 21 a are each sandwiched between barrier layers 21 b that are laminae of larger energy bandgap than that of the well layers 21 a. That is, the plurality of well layers 21 a and the plurality of barrier layers 21 b whose bandgap is larger than that of the well layers 21 a are arranged in alternation. With the active layer 21, all of the plurality of well layers 21 a may be sandwiched between barrier layers 21 b, or the well layers 21 a may be arranged on at least one side of the active layer 21, and the well layers 21 a arranged on the one side of the active layer 21 may be sandwiched by other layers (not illustrated)—such as guide layers or cladding layers—disposed along the one side, and barrier layers 21 b.

It should be understood that the region XIII indicated in FIG. 13 is not limited to being an upper portion within the active layer 21.

The active layer 21 preferably has between two and one-hundred both inclusive, more preferably between ten and fifty both inclusive, well layers 21 a and barrier layers 21 b, respectively. An implementation having two or more well layers 21 a as well as barrier layers 21 b constitutes a multiquantum-well structure. An implementation having ten or more well layers 21 a as well as barrier layers 21 b improves light output by improving the optical emission efficiency. Implementations with not more than one-hundred layers allow the costs required in order to build the active layer 21 to be reduced. Implementations with not more than fifty layers allow the costs required in order to build the active layer 21 to be further reduced.

The height H21 of the active layer 21 preferably is between 6 nm and 2 μm both inclusive. Implementations in which the height H21 is not less than 6 nm allow the emission intensity to be improved. Implementations in which the thickness H21 is not more than 2 μm let productivity be improved.

The height H21 a of the well layers 21 a preferably is between 3 nm and 20 nm both inclusive. The height H21 b of the barrier layers 21 b preferably is between 5 nm and 1 pm both inclusive.

While the material constituting the well layers 21 a is not particularly limited as long as it has a bandgap that is smaller than that of the barrier layers 21 b, materials such as GaAs, AlGaAs, InGaAs (indium gallium arsenide) and AlInGaAs (aluminum indium gallium arsenide) can be utilized. These materials are infrared light-emitting substances whose lattice match with AlGaAs is quite suitable.

In instances where epitaxial wafers 20 a are utilized in infrared LEDs whose output wavelength is 900 nm or greater, the material for the well layers 21 a preferably contains In, by being InGaAs in which the amount fraction of 1 n is not less than 0.05. And in implementations in which the well layers 21 a include a material containing In, preferably the active layer 21 will have not more than four laminae each of the well layers 21 a and the barrier layers 21 b. More preferably, the active layer 21 will have not more than three laminae of each.

While the material constituting the barrier layers 21 b is not particularly limited as long as it has a bandgap that is larger than that of the well layers 21 a, materials such as AlGaAs, InGaP AlInGaP and InGaAsP can be utilized. These materials are substances whose lattice match with AlGaAs is quite suitable.

In instances where epitaxial wafers 20 a are utilized in infrared LEDs whose output wavelength is 900 nm or greater, preferably 940 nm or greater, the material for barrier layers 21 b inside the active layer 21 preferably contains P, by being GaAsP or AlGaAsP in which the amount fraction of P is not less than 0.05. And in implementations in which the barrier layers 21 b include a material containing P, preferably the active layer 21 will have not less than three laminae each of the well layers 21 a and the barrier layers 21 b.

It is preferable that the concentration of atomic elements apart from the atoms within the epitaxial layer containing the active layer 21 (for example, elements such as atoms within the atmosphere in which growth is carried out) be low.

It will be appreciated that the active layer 21, not particularly limited to being a multiquantum-well structure, may be composed of a single layer, or may be a double-heterostructure.

Also, although in the present embodying mode an implementation in which only the active layer 21 is included as an epitaxial layer has been explained, other layers such as cladding layers and undoped layers may further be included.

To continue: With reference to FIG. 14, an explanation of a method of manufacturing an infrared-LED epitaxial wafer 20 a in the present embodying mode will be made.

As indicated in FIG. 14, initially an Al_(x)Ga_((1-x))As substrate 10 a is manufactured by a method in Embodying Mode 1 of manufacturing an Al_(x)Ga_((1-x))As substrate 10 a (Steps S1 through S5).

Next, an epitaxial layer containing an active layer 21 is deposited by OMVPE onto the major surface 11 a of the Al_(x)Ga_((1-x))As layer 11 (Step S7).

In Step S7, it is preferable that the epitaxial layer (in the present embodying mode, the active layer 21) be formed in such a manner that the amount fraction x of Al in the epitaxial layer in its plane of contact of with the Al_(x)Ga_((1-x))As layer 11 (in the epitaxial layer's rear face 21 c) be greater than the amount fraction x of Al in the Al_(x)Ga_((1-x))As layer in its plane of contact with the epitaxial layer (in the major surface 11 a in the present embodying mode). It is also preferable that the amount fraction x of Al in the lamina of greatest thickness in the epitaxial layer be greater than the amount fraction x of Al in the Al_(x)Ga_((1-x))As layer 11 in its plane of contact with the epitaxial layer.

Organometallic vapor-phase epitaxy grows an active layer 21 by precursor gases thermal-decomposition reacting above the Al_(x)Ga_((1-x))As layer 11, while molecular-beam epitaxy grows an active layer 21 by a technique that does not mediate the chemical-reaction stages in a non-equilibrium system; thus, the OMVPE and MBE techniques allow the thickness of the active layer 21 to be readily controlled.

An active layer 21 having plural well layers 21 a of two or more laminae may therefore be grown.

Furthermore, the height H21 of the epitaxial layer (active layer 21 in the present embodying mode) relative to the height H11 of the Al_(x)Ga_((1-x))As layer 11 (the ratio H21/H11) is, for example, preferably between 0.05 and 0.25 both inclusive, more preferably between 0.15 and 0.25 both inclusive. Such implementations make it possible to mitigate incidence of warp in the state in which an epitaxial layer has been grown onto an Al_(x)Ga_((1-x))As layer 11.

In this Step S7, an epitaxial layer containing an active layer 21 as described above is grown onto the Al_(x)Ga_((1-x))As layer 11.

Specifically, an active layer 21 is formed having between two and one-hundred (both inclusive), more preferably between ten and fifty (both inclusive), well layers 21 a and barrier layers 21 b, respectively.

It is also preferable that the active layer 21 be grown so as to have a height H21 of from 6 nm to 2 μm. Growing well layers 21 a having a height H21 a of from 3 nm to 20 nm, and barrier layers 21 b having a height H21 b of from 5 nm to 1 μm is likewise preferable.

Growing well layers 21 a made from GaAs, AlGaAs, InGaAs, AlInGaAs, or the like, and barrier layers 21 b made from AlGaAs, InGaP, AlInGaP, GaAsP, AlGaAsP, InGaAsP, or the like is also preferable.

For the active layer 21 it does not matter whether there is lattice misalignment (lattice relaxation) in the GaAs and AlGaAs that constitute the Al_(x)Ga_((1-x))As substrate. If there is lattice misalignment in the well layers 21 a, lattice misalignment in the opposite direction may be imparted to the barrier layers 21 b to balance, for the structure of the epitaxial wafer overall, strain in the crystal from compression—extension. Further, the crystal warpage may be may be at or below, or at or above the lattice-relaxing limit. However, because dislocations threading through the crystal are liable to occur if the warpage is at or above the lattice-relaxing limit, desirably it is at or below the limit.

As an example, an instance in which InGaAs is utilized for the well layers 21 a will be given. Because the lattice constant of InGaAs is large with respect to the GaAs substrate, lattice relaxation occurs if an epitaxial layer of a fixed thickness or greater is grown. Therefore, favorable crystal in which the occurrence of crystal-threading dislocations is kept to a minimum can be obtained by having the thickness be below the level at which lattice relaxation occurs.

Likewise, if GaAsP is utilized for the barrier layers 21 b, because the lattice constant of GaAsP is small relative to the GaAs substrate, lattice relaxation occurs when epitaxial layer of fixed thickness or greater is grown thereon. Therefore, favorable crystal in which the occurrence of crystal-threading dislocations is kept to a minimum can be obtained by having the thickness be below the level at which lattice relaxation occurs.

Lastly, taking advantage of the features that with respect to the GaAs substrate the lattice constant of InGaAs is large while the lattice constant of GaAsP is small, by utilizing InGaAs for the well layers 21 a and GaAsP for the barrier layers 21 b to balance out the lattice warp in the crystal as a whole, favorable crystal in which the occurrence of crystal-threading dislocations is kept to a minimum can be obtained up to or above the thickness levels just mentioned, without causing lattice relaxation.

By implementing the foregoing Steps S1 through S5 and S7, the epitaxial wafer 20 a depicted in FIG. 12 may be manufactured.

It will be appreciated that Step S6 of removing the GaAs substrate 13 may be additionally be implemented. Step S6 here may be implemented, for example, after Step S7 of growing an epitaxial layer, but is not particularly limited to that sequence. Step S6 may be implemented in between polishing Step S4 and washing Step S5, for example. Step S6 here is the same as Step S6 of Embodying Mode 2 and thus its explanation will not be repeated. In instances in which Step S6 is carried out, a structure that is the same as that of later-described epitaxial wafer 20 b of FIG. 15 results.

As described in the foregoing, an infrared-LED epitaxial wafer 20 a in the present embodying mode is furnished with an Al_(x)Ga_((1-x))As substrate 10 a of Embodying Mode 1, and an epitaxial layer, formed on the major surface 11 a of the Al_(x)Ga_((1-x))As layer 11 in the Al_(x)Ga_((1-x))As substrate 10 a, and containing an active layer 21.

Furthermore, a method of manufacturing an infrared-LED epitaxial wafer 20 a in the present embodying mode is provided with a process (Steps S1 through S6) of manufacturing an Al_(x)Ga_((1-x))As substrate 10 a by an Al_(x)Ga_((1-x))As substrate 10 a manufacturing method of Embodying Mode 1, and a step (Step S7) of forming an epitaxial layer containing an active layer 21 onto the major surface 11 a of the Al_(x)Ga_((1-x))As layer 11 by at least either OMVPE or MBE.

According to an infrared-LED epitaxial wafer 20 a, and a method of its manufacture, in the present embodying mode, an epitaxial layer is formed onto an Al_(x)Ga_((1-x))As substrate 10 a furnished with an Al_(x)Ga_((1-x))As layer 11 in which the amount fraction x of Al in its major surface 11 a is lower than in its rear face 11 b. Consequently, an infrared-LED epitaxial wafer 20 a can be realized in which a high level of transparency is maintained, and with which, when the epitaxial wafer 20 a is utilized to fabricate a semiconductor device, the device proves to have superior characteristics.

In the above-described infrared-LED epitaxial wafer 20 a and method of is manufacture, it is preferable that the amount fraction x of Al in the epitaxial layer in its plane of contact with the Al_(x)Ga_((1-x))As layer 11 (in the reverse face 21 c of the epitaxial layer) be greater than the amount fraction x of Al in the Al_(x)Ga_((1-x))As layer 11 in its plane of contact with the epitaxial layer (in the major surface 11 a).

These conditions, when the Al_(x)Ga_((1-x))As layer 11 and the epitaxial layer are regarded as a whole, can mitigate warp in the epitaxial wafer 20 a, for the same reasons discussed in Embodying Mode 1.

In the above-described method of manufacturing an infrared-LED epitaxial wafer 20 a, preferably provided are: a step of preparing a GaAs substrate 13 (Step S1); a step of growing onto the GaAs substrate 13 by LPE an Al_(x)Ga_((1-x))As layer 11 as a window layer that diffuses current and that will transmit light from the active layer (Step S2); a step of polishing the major surface 11 a of the Al_(x)Ga_((1-x))As layer 11 (Step S4); and a step growing onto the major surface 11 a of the Al_(x)Ga_((1-x))As layer 11, by at least either OMVPE or MBE, an active layer 21 having a multiquantum-well structure and whose energy bandgap is smaller than that of the Al_(x)Ga_((1-x))As layer 11 (Step S7).

Owing to the Al_(x)Ga_((1-x))As layer 11 being grown (Step S2) by the LPE technique, the growth rate is rapid. With LPE, moreover, since expensive precursor gases and expensive apparatus need not be employed, the manufacturing costs are low. Therefore, more than with the OMVPE and MBE techniques, costs can be reduced and considerably thick Al_(x)Ga_((1-x))As layers 11 formed. Unevenness on the major surface 11 a of the Al_(x)Ga_((1-x))As layer 11 can be reduced by polishing the major surface 11 a of the Al_(x)Ga_((1-x))As layer 11. Therefore, in forming onto the major surface 11 a of the Al_(x)Ga_((1-x))As layer 11 an epitaxial layer containing an active layer 21, abnormal growth of the epitaxial layer containing the active layer 21 can be kept under control. Meanwhile, OMVPE, by the thermal-decomposition reaction of the precursor gases, and MBE, which does not mediate the chemical-reaction stages in a non-equilibrium system, allow the film thickness to be optimally controlled. Consequently, forming the epitaxial layer containing the active layer 21 by OMVPE or MBE after Step S4 of polishing the major surface 11 a enables abnormal growth to be held in check, and makes it possible to form an active layer having a multiquantum-well structure (MQW structure) in which the film thickness of the active layer 21 has been optimally controlled.

Especially since with LEDs, instances in which the film thickness is less than with laser diodes (LDs) are numerous, utilizing the OMVPE or MBE techniques, whereby film-thickness controllability is excellent, allows an epitaxial layer containing an active layer 21 having a multiquantum-well structure to be formed.

Here the active layer 21 is grown by OMVPE or MBE following Step S2 of growing the Al_(x)Ga_((1-x))As layer 11 by LPE. Growing the active layer 21 by OMVPE or MBE after the liquid-phase epitaxy prevents extended-duration, high-temperature heat from being applied to the active layer 21. Deterioration of crystallinity due to crystalline defects arising in the active layer 21 on account of the high-temperature heat may therefore be prevented, and diffusion into the active layer 21 of dopants introduced by the LPE may be held in check.

After Step S7 of growing the active layer 21 in the present embodying mode, the active layer 21 is not exposed to the high-temperature ambients employed in liquid-phase epitaxy, and thus p-type dopants for example, which diffuse readily, introduced into the Al_(x)Ga_((1-x))As layer 11 may be prevented from diffusing to inside the active layer 21. This allows the concentration in the active layer 21 of p-type carriers such as Zn, Mg and C to be held low—to, for example, 1×10¹⁸ cm⁻³ or under. Problems owing to such carriers, such as the formation of impurity bands in the active layer 21, therefore may be prevented, allowing the difference in bandgap between the well layers 21 a and the barrier layers 21 b to be sustained.

Accordingly, since an active layer 21 having an improved-performance multiquantum-well structure may be formed, when the GaAs substrate 13 is removed (Step S6) and the device electrodes formed, by the altering of the state density in the active layer 21 efficient recombination of electrons and holes takes place. Epitaxial wafers 20 a for constituting improved-emission-efficiency infrared LEDs can therefore be grown.

It will be appreciated that with the Al_(x)Ga_((1-x))As layer 11 as a window layer, since electric current is diffused in a direction (horizontally in FIG. 1) that intersects the direction along which the Al_(x)Ga_((1-x))As layer 11 and the active layer 21 are laminated (vertically in FIG. 1), the light-extraction efficiency is improved, thereby allowing the optical emission efficiency to be improved.

In the above-described method of manufacturing an infrared-LED epitaxial wafer 20 a, it is preferable that Steps S3 and S5 of washing the surface of the Al_(x)Ga_((1-x))As layer 11 be provided at least either between Al_(x)Ga_((1-x))As layer 11 growth Step S2 and polishing Step S4, or between polishing Step S4 and epitaxial layer growth Step S7.

Even should impurities cling to or mix into the Al_(x)Ga_((1-x))As layer 11 due to the Al_(x)Ga_((1-x))As layer 11 coming into contact with atmospheric air, the impurities may be cleared away by thus providing the washing steps.

In the above-described method of manufacturing an infrared-LED epitaxial wafer 20 a, it is preferable that in washing Steps S3 and S5, an alkaline solution be employed to wash the major surface 11 a.

When impurities have clung to or mixed into the Al_(x)Ga_((1-x))As layer 11, this preferred application of the washing steps allows the impurities to be more effectively removed from the Al_(x)Ga_((1-x))As layer 11.

In the above-described infrared-LED epitaxial wafer 20 a and method of its manufacture, it is preferable that the height H11 of the Al_(x)Ga_((1-x))As layer 11 be between 10 μm and 1000 μm both inclusive, and more preferable that it be between 20 μm and 140 μm both inclusive.

Implementations in which the height H11 is as least 10 μm allow optical emission efficiency to be improved. Implementations in which the height H11 is 20 μm or more enable further improvement of optical emission efficiency. Keeping the height H11 to 1000 μm or less reduces the costs required to form the Al_(x)Ga_((1-x))As layer 11. Keeping the height H11 to 140 μm or less further allows the costs involved in the deposition of the Al_(x)Ga_((1-x))As layer 11 to be held down.

In the above-described infrared-LED epitaxial wafer 20 a and method of its manufacture, it is preferable that in the active layer 21, the well layers 21 a and the barrier layers 21 b, of bandgap larger than that of the well layers 21 a, be disposed in alternation, and that the active layer 21 has between ten and fifty (both inclusive) well layers 21 a and between ten and fifty (both inclusive) barrier layers 21 b.

Implementations with ten or more layers allow further improvement in optical emission efficiency, while implementations with no more than fifty layers allow the costs involved in forming the active layer 21 to be held down.

With the foregoing infrared-LED epitaxial wafer 20 a and method of its manufacture, preferably they are an epitaxial wafer utilized in infrared LEDs whose emission wavelength is 900 nm or greater, and a method of manufacturing such a wafer, wherein the well layers 21 a inside the active layer 21 include a material containing In, and the well layers 21 a number four or fewer laminae. The emission wavelength more preferably is 940 nm or greater.

By forming an active layer 21 including a material containing In and having four or fewer well layers, the present inventors discovered that lattice relaxation was kept under control. They therefore were able to realize an epitaxial wafer that can be utilized in infrared LEDs whose wavelength is 900 nm or greater.

In the foregoing infrared-LED epitaxial wafer 20 a and method of its manufacture, preferably the well layers 21 a are of InGaAs in which the amount fraction of indium is 0.05 or greater.

That makes it possible to realize a useful epitaxial wafer 20 a that can be utilized in infrared LEDs whose wavelength is 900 nm or greater.

With the above-described epitaxial wafer 20 a for infrared LEDs and the method of its manufacture, preferably they are an epitaxial wafer utilized in an infrared LED whose emission wavelength is 900 nm or greater, and a method of manufacturing such a wafer, wherein the barrier layers 21 b inside the active layer 21 include a material containing P, with the number of barrier layers 21 b being three or more laminae.

By forming an active layer 21 including a material containing P, the present inventors discovered that lattice relaxation was kept to a minimum. They therefore were able to realize an epitaxial wafer that can be utilized in infrared LEDs whose wavelength is 900 nm or greater.

In the foregoing infrared-LED epitaxial wafer and method of its manufacture, preferably the barrier layers 21 b are of either GaAsP or AlGaAsP in which the amount fraction of P is 0.05 or greater.

That makes it possible to realize a useful epitaxial wafer 20 a that can be utilized in infrared LEDs whose wavelength is 900 nm or greater.

Embodying Mode 4

Referring to FIG. 15, an explanation of an infrared-LED epitaxial wafer 20 b in the present embodying mode will be made.

As indicated in FIG. 15, an epitaxial wafer 20 b in the present embodying mode is furnished with an Al_(x)Ga_((1-x))As substrate 10 b set out in Embodying Mode 2, represented in FIG. 10, and, formed onto the major surface 11 a of the Al_(x)Ga_((1-x))As layer 11, an epitaxial layer containing an active layer 21.

And an epitaxial wafer 20 b in the present embodying mode is furnished with a structural makeup that basically is the same as that of an epitaxial wafer 20 a of Embodying Mode 3, but differs in that it is not furnished with a GaAs substrate 13.

To continue: With reference to FIG. 16, an explanation of a method of manufacturing an epitaxial wafer 20 b in the present embodying mode will be made.

As indicated in FIG. 16, initially an Al_(x)Ga_((1-x))As substrate 10 b is manufactured by a method in Embodying Mode 2 of manufacturing an Al_(x)Ga_((1-x))As substrate 10 b (Steps S1, S2, S3, S4, S6 and S5).

Next, in the same manner as in Embodying Mode 3, an epitaxial layer containing an active layer 21 is deposited by OMVP onto the major surface 11 a of the Al_(x)Ga_((1-x))As layer 11 (Step S7).

Implementing the foregoing Steps S1 through S7 enables an infrared-LED epitaxial wafer 20 b, represented in FIG. 15, to be manufactured.

It should be understood that apart from the foregoing, the infrared-LED epitaxial wafer 20 b and its method of manufacture are otherwise of the same constitution as the infrared-LED epitaxial wafer 20 a and its method of manufacture in Embodying Mode 3; thus identical components are labeled with identical reference marks, and their explanation will not be repeated.

As described in the foregoing, the infrared-LED epitaxial wafer 20 b in the present embodying mode is furnished with an Al_(x)Ga_((1-x))As layer 11, and an epitaxial layer formed on the major surface 11 a of the Al_(x)Ga_((1-x))As layer 11 and containing an active layer 21.

In addition, a method of manufacturing an infrared-LED epitaxial wafer 20 b in the present embodying mode is provided with a step (Step S6) of removing the GaAs substrate 13.

According to an infrared-LED epitaxial wafer 20 b and its method of manufacture in the present embodying mode, an Al_(x)Ga_((1-x))As substrate 10 b from which the GaAs substrate, which absorbs light in the visible range, has been removed is utilized. Consequently, furthermore forming electrodes on the epitaxial wafer 20 b enables the realization of an infrared-LED-constituting epitaxial wafer 20 b in which a high level of transparency is sustained and superior device characteristics are maintained.

Embodying Mode 5

Referring to FIG. 17, an explanation of an infrared-LED epitaxial wafer 20 c in the present embodying mode will be made.

As indicated in FIG. 17, an epitaxial wafer 20 c in the present embodying mode is furnished with basically the same structural makeup as that of an epitaxial wafer 20 b of Embodying Mode 4, but differs in that the epitaxial layer further includes a contact layer 23. That is, in the present embodying mode, the epitaxial layer contains an active layer 21 and a contact layer 23.

Specifically, the epitaxial wafer 20 c is furnished with an Al_(x)Ga_((1-x))As layer 11, an active layer 21 formed onto the Al_(x)Ga_((1-x))As layer 11, and a contact layer 23 formed onto the active layer 21.

The contact layer 23 consists of, for example, p-type GaAs and has a height H23 of 0.01 μm or more.

To continue: A method of manufacturing an infrared-LED epitaxial wafer 20 c in the present embodying mode will be made. The method of manufacturing an infrared-LED epitaxial wafer 20 c in the present embodying mode is furnished with the same constitution as the epitaxial wafer 20 b manufacturing method of Embodying Mode 4, but differs in that Step S7 of forming an epitaxial layer furthermore includes a substep of forming a contact layer 23.

Specifically, after the active layer 21 is grown, a contact layer 23 is formed onto the surface of the active layer 21. Although the method whereby the contact layer 23 is formed is not particularly limited, preferably it is grown by at least either OMVPE or MBE, or else by a combination of the two, because these deposition techniques allow the formation of thin-film layers. And the contact layer 23 is preferably grown by the same technique as is the active layer 21, because it can then be grown continuously with growth of the active layer 21.

It should be understood that apart from the foregoing, the infrared-LED epitaxial wafer and its method of manufacture are otherwise of the same constitution as the infrared-LED epitaxial wafer 20 b and its method of manufacture in Embodying Mode 4; thus identical components are labeled with identical reference marks, and their explanation will not be repeated.

It will be appreciated that the infrared-LED epitaxial wafer 20 c and its method of manufacture in the present embodying mode can find application not only in Embodying Mode 4, but in Embodying Mode 3 as well.

Embodying Mode 6

Referring to FIG. 18, an explanation of an infrared LED 30 a in the present embodying mode will be made. As indicated in FIG. 18, an infrared LED 30 a in the present embodying mode is furnished with an infrared-LED epitaxial wafer 20 c, represented in FIG. 17, of Embodying Mode 5, electrodes 31 and 32, formed respectively on the front side 20 c 1 and back side 20 c 2 of the epitaxial wafer 20 c, and a stem 33.

The electrode 31 is provided contacting on the front side 20 c 1 of the epitaxial wafer 20 c (on the contact layer 23 in the present embodying mode), while the electrode 32 is provided contacting on the back side 20 c 2 (on the Al_(x)Ga_((1-x))As layer 11 in the present embodying mode). The stem 33 is provided contacting on the electrode 31, on its reverse side from the epitaxial wafer 20 c.

To give specifics of the LED 30 a makeup: The stem 33 is constituted from, for example, an iron-based material. The electrode 31 is a p-type electrode constituted from, for example, an alloy of gold (Au) and zinc (Zn). The electrode 31 is formed onto the p-type contact layer 23. The contact layer 23 is formed on the top of the active layer 21. The active layer 21 is formed on the top of the Al_(x)Ga_((1-x))As layer 11. The electrode 32 formed onto the Al_(x)Ga_((1-x))As layer 11 is an n-type electrode constituted from, for example, an alloy of Au and Ge (germanium).

To continue: With reference to FIG. 19, an explanation of a method of manufacturing an infrared LED 30 a in the present embodying mode will be made.

Initially, an epitaxial wafer 20 a is manufactured by the procedure of Embodying Mode 3 for manufacturing an infrared-LED epitaxial wafer 20 a (Steps S1 through S5, and S7). In this case, the active layer 21 and the contact layer are formed in Step S7 of growing an epitaxial layer. Next, the GaAs substrate is removed (Step S6). It will be appreciated that implementing Step S6 allows an infrared-LED epitaxial wafer 20 c as represented in FIG. 17 to be manufactured.

Subsequently, electrodes 31 and 32 are formed on the front side 20 c 1 and back side 20 c 2 of the infrared-LED epitaxial wafer 20 c (Step S11). Specifically, by a vapor-deposition technique, for example, Au and Zn are vapor-deposited onto the front side 20 c 1, and further, Au and Ge are alloyed after being vapor-deposited onto the back side 20 c 2, to form the electrodes 31 and 32.

Next, the LED is surface mounted (Step S12). To give a specific example: The electrode-31 side is turned down, and die-attachment is carried out on the stem 33 with a die-attach adhesive such as an Ag paste, or with a eutectic alloy such as AuSn.

Implementing the aforedescribed Steps S1 through S12 enables an infrared LED 30 a, represented in FIG. 18, to be manufactured.

It should be understood that in the present embodying mode, although an implementation utilizing an Embodying Mode 5 epitaxial wafer 20 c for infrared LEDs has been described, an infrared-LED epitaxial wafer 20 a or 20 b of Embodying Modes 3 or 4 is also applicable. Prior to completion of the infrared LED, however, Step S6 of removing the GaAs substrate 13 may be implemented.

As described in the foregoing, an infrared LED 30 a in the present embodying mode is furnished with: an Al_(x)Ga_((1-x))As substrate 10 b of Embodying Mode 2; an epitaxial layer formed onto the major surface 11 a of the Al_(x)Ga_((1-x))As layer 11 and including an active layer 21; a first electrode 31, formed on the front side 20 c 1 of the epitaxial layer; and a second electrode 32, formed on the back side 20 c 2 of the Al_(x)Ga_((1-x))As layer 11.

In turn, an infrared LED 30 a in the present embodying mode is furnished with: a process of manufacturing an Al_(x)Ga_((1-x))As substrate 10 b by an Al_(x)Ga_((1-x))As substrate 10 b manufacturing method of Embodying Mode 2 (Steps S1 through S6); a step of forming an epitaxial layer containing an active layer 21 onto the major surface 11 a of the Al_(x)Ga_((1-x))As layer 11 by OMVPE (Step S7); a step of forming a first electrode 31 onto the front side 20 c 1 of the epitaxial wafer 20 c (Step S11); and a step of forming a second electrode 32 onto the rear face 11 b of the Al_(x)Ga_((1-x))As layer 11 (Step S11).

According to an infrared LED 30 a and method of its manufacture in the present embodying mode, since an Al_(x)Ga_((1-x))As substrate 10 b in which the amount fraction x of Al in the Al_(x)Ga_((1-x))As layer 11 has been controlled is utilized, infrared LEDs 30 a that sustain a high level of transmissivity and which, in the fabrication of semiconductor devices, have superior characteristics may be realized.

Further, the electrode 31 is formed on the wafer's active layer 21 side, while the electrode 32 is formed on its Al_(x)Ga_((1-x))As layer 11 side. This structure enables current from the electrode 32 to be more diffused across the entire surface of the infrared LED 30 a by means of the Al_(x)Ga_((1-x))As layer 11. Infrared LEDs 30 a of further improved optical emission efficiency can therefore be obtained.

Embodying Mode 7

As indicated in FIG. 20, an infrared LED 30 b in the present embodying mode is furnished with basically the same structural makeup as an infrared LED 30 a of Embodying Mode 6, but differs in that the wafer's Al_(x)Ga_((1-x))As layer 11 side is disposed on the stem 33.

Specifically, the electrode 31 is provided contacting on the front side 20 c 1 of the epitaxial wafer 20 c (on the contact layer 23 in the present embodying mode), while the electrode 32 is provided contacting on the back side 20 c 2 (on the Al_(x)Ga_((1-x))As layer 11 in the present embodying mode).

The electrode 31 partially covers the front side 20 c 1 of the epitaxial wafer 20 c, leaving the remaining area on the front side 20 c 1 of the epitaxial wafer 20 c exposed in order for light to be extracted. The electrode 32, meanwhile, covers the entire surface of the back side 20 c 2 of the epitaxial wafer 20 c.

A method of manufacturing an infrared LED 30 b in the present embodying mode is furnished with basically the same constitution as the method of Embodying Mode 6 of manufacturing an infrared LED 30 a, but as just described differs in Step S11 of forming the electrodes 31 and 32.

It should be understood that apart from the foregoing, the infrared LED 30 b and its method of manufacture are otherwise of the same constitution as the infrared LED 30 a and its method of manufacture in Embodying Mode 6; thus identical components are labeled with identical reference marks, and their explanation will not be repeated.

Further, in instances in which the GaAs substrate 13 has not been removed, an electrode may be formed on the reverse face of the GaAs substrate 13. With an epitaxial wafer 20 a of Embodying Mode 3, in the case where an epitaxial wafer in which its epitaxial layer further includes a contact layer is utilized to form an infrared LED, it will have a structure like, for example, infrared LED 30 c illustrated in FIG. 27. In this case, as indicated in FIG. 27 as a representative example, the stem 33 is arranged on the GaAs substrate 13 side of the device. As a modified example of this, the GaAs substrate 13 side may be located on the opposite side of the device from that of the stem 33.

Embodying Mode 8

Referring to FIG. 28, an explanation of an infrared-LED epitaxial wafer 20 d in the present embodying mode will be made.

As indicated in FIG. 28, an epitaxial wafer 20 d in the present embodying mode is furnished with basically the same structural makeup as that of an epitaxial wafer 20 b of Embodying Mode 4, but differs in being further furnished with a cement layer 25 and a support substrate 26. That is, the epitaxial wafer 20 d is furnished with an Al_(x)Ga_((1-x))As substrate 10 b (Al_(x)Ga_((1-x))As layer 11) of Embodying Mode 2, an epitaxial layer (active layer 21), the cement layer 25, and the support substrate 26.

Specifically, the cement layer 25 is formed onto the major surface 21 a 1 of the active layer 21, on the reverse side thereof from its plane (reverse face 21 b 1) of contact with the Al_(x)Ga_((1-x))As layer 11. The support substrate 26 is joined, via the cement layer 25, to the major surface 21 a 1 of the active layer 21.

The cement layer 25 and the support substrate 26 preferably are materials that are electroconductive. As such a material, the support substrate 26 preferably is constituted from matter containing at least one substance selected from the group consisting of silicon, gallium arsenide, and silicon carbide. For the cement layer 25, an alloy such as gold-tin (AuSn) or gold-indium (AuIn) can be utilized.

Herein, “being electroconductive” means that the conductance is not less than 10 siemens/cm.

To continue: With reference to FIGS. 28 through 30, an explanation of a method of manufacturing an infrared-LED epitaxial wafer 20 d in the present embodying mode will be made.

As indicated in FIG. 29, initially an Al_(x)Ga_((1-x))As substrate 10 a is manufactured by a method in Embodying Mode 1 of manufacturing an Al_(x)Ga_((1-x))As substrate 10 a (Steps S1 through S5).

Next, an epitaxial layer containing an active layer 21 is deposited by at least either OMVPE or MBE onto the major surface 11 a of the Al_(x)Ga_((1-x))As layer 11 (Step S7).

Step S7 here is the same as in Embodying Mode 3 and thus its explanation will not be repeated.

Next, the major surface 21 a 1 of the epitaxial layer, on the reverse side thereof from the epilayer's plane (reverse face 21 b 1) of contact with the Al_(x)Ga_((1-x))As layer 11, and the support substrate 26 are bonded together via the cement layer 25 (Step S8). In Step S8, a support substrate 26 and a cement layer 25 of, for example, the above-described materials are utilized.

In instances in which a metallic material such as AuSn is employed as the cement layer 25, with the support substrate 26 and the major surface 21 a 1 of the active layer 21 facing each other through an intervening solder, for example, such as AuSn, by heating the solder to above its melting point and hardening it, the epitaxial layer and the support substrate 26 are joined together. The laminate structure represented in FIG. 30 is thereby obtained.

Next, the GaAs substrate 13 is removed from the laminate structure in FIG. 30 (Step S6). Since Step S6 of removing the GaAs substrate 13 is the same as in Embodying Mode 2, its explanation will not be repeated.

Implementing the aforedescribed process (Steps S1, S2, S3, S4, S5, S7, S8 and S6) enables an epitaxial wafer 20 d, represented in FIG. 28, to be manufactured.

As explained in the foregoing, an infrared-LED epitaxial wafer 20 d in the present embodying mode is furnished with: the Al_(x)Ga_((1-x))As substrate 10 b set forth in Embodying Mode 2; an epitaxial layer formed onto the major surface 11 a of the Al_(x)Ga_((1-x))As layer 11 in the Al_(x)Ga_((1-x))As substrate 10 b, and including an active layer 21; a cement layer 25 formed onto the major surface 21 a 1 of the epitaxial layer, on the reverse side thereof from its plane (reverse face 21 b 1) of contact with the Al_(x)Ga_((1-x))As layer 11; and a support substrate 26 joined, via the cement layer 25, to the major surface 21 a 1 of the epitaxial layer.

And a method of manufacturing an infrared-LED epitaxial wafer 20 d in the present embodying mode is provided with: a process (Steps S1 through S5) of manufacturing an Al_(x)Ga_((1-x))As substrate 10 a by the method set forth in Embodying Mode 1 of manufacturing an Al_(x)Ga_((1-x))As substrate 10 a; a step of forming an epitaxial layer containing an active layer 21 onto the major surface 11 a of the Al_(x)Ga_((1-x))As layer 11 by at least either OMVPE or MBE (Step S7); a step of bonding, via the cement layer 25, the major surface 21 a 1 of the epitaxial layer, on the reverse side thereof from the epilayer's plane (reverse face 21 b 1) of contact with the Al_(x)Ga_((1-x))As layer 11, together with the support substrate 26 (Step S8); and a step of removing the GaAs substrate 13 (Step S6).

In accordance with, in the present embodying mode, an infrared-LED epitaxial wafer 20 d and method of its manufacture, handling is facilitated by the fact that a support substrate 26 is formed.

Also, forming the support substrate 26 enables the Al_(x)Ga_((1-x))As layer 11 (Al_(x)Ga_((1-x))As substrate) to be narrowed down in thickness, whereby warp in the Al_(x)Ga_((1-x))As substrate may be reduced. Yields of infrared LEDs furnished with the epitaxial wafer 20 d can consequently be improved.

In addition, inasmuch as the thickness of the Al_(x)Ga_((1-x))As substrate can be narrowed down, absorbance of light by the Al_(x)Ga_((1-x))As substrate can be reduced. Therefore, inasmuch as an epitaxial layer can be formed onto the Al_(x)Ga_((1-x))As substrate, the quality of the active layer 21 can be improved.

Furthermore, on account of the thickness of the support substrate 26, a process of augmenting the level of roughness of the episurface of the epitaxial wafer 20 d (surface-roughening treatment) can be performed with ease. The occurrence of the phenomenon giving rise to the total reflection of light output from the episurface of the epitaxial wafer may thereby be kept under control. The intensity of light output from the episurface of the epitaxial wafer 20 d can therefore be heightened.

With the just-described infrared-LED epitaxial wafer 20 d and method of its manufacture, preferably the cement layer 25 and the support substrate 26 are materials that are electroconductive. It is preferable that as such a material, the support substrate 26 be constituted from matter containing at least one substance selected from the group consisting of silicon, gallium arsenide, and silicon carbide. This enables, in implementations in which an infrared LED has been rendered by forming electrodes on the major surface and rear face of the epitaxial wafer 20 d, power to be supplied smoothly to the infrared LED by voltage being applied across the two electrodes.

Embodying Mode 9

Referring to FIG. 31, an explanation of an infrared-LED epitaxial wafer 20 e in the present embodying mode will be made. An infrared-LED epitaxial wafer 20 e in the present embodying mode is furnished with basically the same structural makeup as that of an epitaxial wafer 20 d of Embodying Mode 8, but differs in being additionally provided with an electroconductive layer 27 and a reflective layer 28, formed in between the cement layer 25 and the epitaxial layer.

Specifically, the electroconductive layer 27 is formed on the major surface 21 a 1 of the active layer 21, on the reverse side thereof from its plane (reverse face 21 b 1) of contact with the Al_(x)Ga_((1-x))As layer 11. The reflective layer 28 is formed in between the cement layer 25 and the electroconductive layer 27.

The electroconductive layer 27 is transparent with respect to the light that the active layer 21 emits. As material to be such, it preferably is constituted from matter containing at least one substance selected from the group consisting of mixtures of indium oxide and tin oxide, zinc oxide containing aluminum atoms, tin oxide containing fluorine atoms, zinc oxide, zinc selenide, and gallium oxide.

Herein, the foregoing “transparent” means that, for example, when light having a given wavelength is incident on the electroconductive layer 27, the incident light is transmitted at 80% or greater transmissivity.

The reflective layer 28 is made of a metallic material that reflects light. As material to be such, it is constituted from matter containing at least one substance selected from the group consisting of aluminum, gold, platinum, silver, copper, chrome, and palladium.

To continue: Referring to FIGS. 29, 31 and 32, an explanation of an infrared-LED epitaxial wafer 20 e in the present embodying mode will be made.

As indicated in FIG. 29, initially an Al_(x)Ga_((1-x))As substrate 10 a is manufactured by a method in Embodying Mode 1 of manufacturing an Al_(x)Ga_((1-x))As substrate 10 a (Steps S1 through S5).

Next, an epitaxial layer containing an active layer 21 is deposited by at least either OMVPE or MBE onto the major surface 11 a of the Al_(x)Ga_((1-x))As layer 11 (Step S7).

Step S7 here is the same as in Embodying Mode 3 and thus its explanation will not be repeated.

Next, an above-described electroconductive layer 27 is formed onto the major surface 21 a 1 of the epitaxial layer, on the reverse side thereof from the epilayer's plane (reverse face 21b1) of contact with the Al_(x)Ga_((1-x))As layer 11. The method whereby the electroconductive layer 27 is formed is not particularly limited; any conventional, universally known technique of choice, such as film formation by an e-beam deposition apparatus, for example, can be employed.

An above-described reflective layer 28 is then formed on the surface of the electroconductive layer 27 on the reverse side thereof from its plane of contact with the epitaxial layer. The method whereby the reflective layer 28 is formed is not particularly limited; any conventional, universally known technique of choice, such as film formation by an e-beam deposition apparatus, for example, can be employed.

Next the major surface 21 a 1 of the epitaxial layer, on the reverse side thereof from the epilayer's plane (reverse face 21 b 1) of contact with the Al_(x)Ga_((1-x))As layer 11, is bonded via the cement layer 25 together with the support substrate 26 (Step S8). In Step S8 of the present embodying mode, the reflective layer 28 and the support substrate 26 are joined via the cement layer 25. The laminate structure represented in FIG. 32 is thereby obtained.

The GaAs substrate 13 is then removed from the laminate structure of FIG. 32 (Step S6). Since Step S6 of removing the GaAs substrate 13 is the same as in Embodying Mode 2, its explanation will not be repeated.

Implementing the aforedescribed process (Steps S1 through S8) enables an epitaxial wafer 20 e, represented in FIG. 31, to be manufactured.

As explained in the foregoing, an infrared-LED epitaxial wafer 20 e in the present embodying mode is additionally furnished with an electroconductive layer 27 and a reflective layer 28, formed in between the cement layer 25 and the epitaxial layer, with the electroconductive layer 27 being transparent to the light that the active layer 21 emits, and the reflective layer 28 being made of a metallic material that reflects light.

Likewise, a method of manufacturing an infrared-LED epitaxial wafer 20 e in the present embodying mode is furthermore furnished with a step of forming an electroconductive layer 27 and a reflective layer 28 in between the cement layer 25 and the epitaxial layer, with the electroconductive layer 27 being transparent to the light that the active layer 21 emits, and the reflective layer 28 being made of a metallic material that reflects light.

An infrared-LED epitaxial wafer 20 e in the present embodying mode, and as given by its method of manufacture therein, enables light transmitted by the electroconductive layer 27 to be reflected by the reflective layer 28. Therefore, an infrared-LED epitaxial wafer 20 e of the present embodying mode has, in addition to the advantageous effects of Embodying Mode 8, the advantage of enabling the output power to be further enhanced when infrared LEDs are produced.

In the aforedescribed infrared-LED epitaxial wafer 20 e and method of its manufacture, preferably the electroconductive layer 27 is constituted from matter containing at least one substance selected from the group consisting of mixtures of indium oxide and tin oxide, zinc oxide containing aluminum atoms, tin oxide containing fluorine atoms, zinc oxide, zinc selenide, and gallium oxide.

These materials transmit infrared light at a transmissivity of 80% or greater and at the same time, their conductance is 10 siemens/cm or higher. The output power of infrared LEDs utilizing the epitaxial wafer 20 e can therefore be further enhanced.

Likewise, in the aforedescribed infrared-LED epitaxial wafer 20 e and method of its manufacture, preferably the reflective layer 28 is constituted from matter containing at least one substance selected from the group consisting of aluminum, gold, platinum, silver, copper, chrome, and palladium.

These materials enable light to be reflected at a higher rate, thus making it possible to further enhance the output power of infrared LEDs utilizing the epitaxial wafer 20 e.

Embodying Mode 10

Referring to FIG. 33, an explanation of an infrared-LED epitaxial wafer 20 f in the present embodying mode will be made. An infrared-LED epitaxial wafer 20 f in the present embodying mode is furnished with basically the same structural makeup as that of an epitaxial wafer 20 d of Embodying Mode 8, but differs in terms of the cement-layer and support-substrate materials.

The support substrate 36 is a transparent baseplate that transmits the light that the active layer 21 emits. As such a material, the support substrate 36 preferably is constituted from matter containing at least one substance selected from the group consisting of sapphire, gallium phosphide, quartz and spinel.

Further, the cement layer 35 is adhesive with respect to the epitaxial layer and the support substrate 36, and is a transparent adhesive material that transmits the light that the active layer 21 emits. As such a material, the cement layer 35 preferably is constituted from matter containing at least one substance selected from the group consisting of polyimide (PI) resins, epoxy resins, silicone resins, and perfluorocyclobutane (PFCB).

Herein, the aforesaid “transmits the light that the active layer 21 emits” means that incident light is transmitted at 80% or greater transmissivity. Likewise, the foregoing “transparent” means that, for example, when light having a given wavelength is incident on the cement layer 35 or the support substrate 36, the incident light is transmitted at 80% or greater transmissivity.

To continue: Referring to FIGS. 29, 33 and 34, an explanation of an infrared-LED epitaxial wafer 20 f in the present embodying mode will be made. A method of manufacturing an epitaxial wafer 20 f in the present embodying mode is provided with basically the same makeup as that of Embodying Mode 8, but differs in terms of forming an alternative-material cement layer and support substrate. Their materials are as described above.

Here, in implementations where a transparent adhesive agent is employed for the cement layer 25 in bonding Step S8, putting the transparent adhesive agent on at least the one of the support substrate 36 or the major surface 21 a 1 of the active layer 21 and laminating it with the other, for example, joins the epitaxial layer with the support substrate 36. The laminate structure represented in FIG. 34 is thereby obtained.

As explained in the foregoing, with an infrared-LED epitaxial wafer 20 f and method of its manufacture in the present embodying mode, the cement layer 35 is adhesive with respect to the epitaxial layer and the support substrate 36, and is a transparent adhesive material that transmits the light that the active layer 21 emits.

In accordance with, in the present embodying mode, an infrared-LED epitaxial wafer 20 f and method of its manufacture, a transparent adhesive material is utilized as the cement layer 35 to join the epitaxial layer and support substrate 36 together, and a transparent material transmitting 80% or more of light of wavelength of the optical emission from the active layer 21 is utilized for the support substrate 36. This enables light that the active layer 21 emits to propagate passing the transparent adhesive material to the support substrate 36. Consequently, when that light is reflected, passing again through the active layer 21 the light can be output from the episurface of the epitaxial wafer 20 f.

Accordingly, the output from an infrared LED utilizing the epitaxial wafer 20 f can be further enhanced.

In the just-described infrared-LED epitaxial wafer 20 f and method of its manufacture, preferably the cement layer 35 is constituted from matter containing at least one substance selected from the group consisting of polyimide resins, epoxy resins, silicone resins, and perfluorocyclobutane.

Joining the epitaxial layer and the support substrate 36 via a transparent adhesive material, of the aforedescribed materials, as the cement layer 35 makes it possible for the light that the active layer 21 emits to transit the material and be incident on the support-substrate 36 side of the device.

In the just-described infrared-LED epitaxial wafer 20 f and method of its manufacture, preferably the support substrate 36 is a transparent baseplate that transmits the light that the active layer 21 emits. And as such a material, the support substrate 36 preferably is constituted from matter containing at least one substance selected from the group consisting of sapphire, gallium phosphide, quartz and spinel.

Utilizing these materials in a transparent support substrate 36 makes it possible for the light emitted by the active layer 21 to propagate to the support substrate 36, passing the transparent adhesive layer as the cement layer 35, whereby the light can be output at a high level of efficiency from the episurface of the epitaxial wafer 20 f.

Embodying Mode 11

Referring to FIG. 35, an explanation of an infrared LED 30 c in the present embodying mode will be made. An infrared LED 30 c in the present embodying mode is furnished with an epitaxial wafer 20 d of Embodying Mode 8, electrodes 31 and 32, formed respectively on the front side 20 d 1 and back side 20 d 2 of the epitaxial wafer 20 d, and a stem 33 formed on the electrode 31. Since the electrodes 31 and 32, and the stem 33 are the same as in Embodying Mode 6, their explanation will not be repeated.

In turn, a method of manufacturing the infrared LED 30 c in the present embodying mode will be made. To begin with, an epitaxial wafer 20 d is manufactured according to the Embodying-Mode 8 method of manufacturing an epitaxial wafer 20 d (Steps S1 through S8).

Next, the first electrode 32 is formed on the Al_(x)Ga_((1-x))As substrate 10 b (Al_(x)Ga_((1-x))As layer 11), and the second electrode 31 is formed on the support substrate 26 (Step S11). The LED is then surface mounted (Step S12). Steps S11 and S12 are the same as in Embodying Mode 6, and thus their explanation will not be repeated.

The aforedescribed Steps S1 through S8, S11 and S12 make it possible to manufacture the infrared LED 30 c represented in FIG. 35.

As explained in the foregoing, an infrared LED 30 c and method of its manufacture in the present embodying mode enable the realization of an infrared LED 30 c under circumstances in which handling is facilitated by the provision of a support substrate 26. And the Al_(x)Ga_((1-x))As layer 11 can be narrowed down in thickness, whereby warp in the Al_(x)Ga_((1-x))As substrate may be reduced. Yields of infrared LEDs 30 c can consequently be improved.

In addition, inasmuch as the thickness of the Al_(x)Ga_((1-x))As substrate can be narrowed down, absorbance of light by the Al_(x)Ga_((1-x))As substrate can be reduced. The quality of the active layer 21 can therefore be improved. Also, carrying out a process of augmenting the level of roughness of the front side 20 d 1 of the epitaxial wafer 20 d (surface-roughening treatment) is enabled. The occurrence of the phenomenon giving rise to the total reflection of light output from the episurface of the epitaxial wafer 20 d may thereby be kept under control. The light output from the LED 30 c can therefore be enhanced.

Embodying Mode 12

Referring to FIG. 36, an explanation of an infrared LED 30 d in the present embodying mode will be made. An infrared LED 30 d in the present embodying mode is furnished with an epitaxial wafer 20 e of Embodying Mode 9, electrodes 31 and 32, formed respectively on the front side 20 e 1 and back side 20 e 2 of the epitaxial wafer 20 e, and a stem 33 formed on the electrode 31. Since the electrodes 31 and 32, and the stem 33 are the same as in Embodying Mode 6, their explanation will not be repeated.

In turn, a method of manufacturing the infrared LED 30 d in the present embodying mode will be made. To begin with, an epitaxial wafer 20 d is manufactured according to the Embodying-Mode 8 method of manufacturing an epitaxial wafer 20 e. Next the first electrode 32 is formed on the Al_(x)Ga_((1-x))As layer 11, and the second electrode 31 is formed on the support substrate 26. The LED is then surface mounted. The aforedescribed steps make it possible to manufacture the infrared LED 30 d represented in FIG. 36.

As explained in the foregoing, an infrared LED 30 d in the present embodying mode, and as given by its method of manufacture therein, enables light transmitted by the electroconductive layer 27 to be reflected by the reflective layer 28. Therefore, an infrared LED 30 d of the present embodying mode has, in addition to the advantageous effects of Embodying Mode 11, the advantage that its output power may be further enhanced.

Embodying Mode 13

Referring to FIG. 37, an explanation of an infrared LED 30 e in the present embodying mode will be made. An infrared LED 30 e in the present embodying mode is furnished with an epitaxial wafer 20 f of Embodying Mode 10, electrodes 31 and 32, formed respectively onto the front side 20 f 1 of (the Al_(x)Ga_((1-x))As layer 11 in) the epitaxial wafer 20 f, and onto an epilayer 21 c 1 of polarity differing from that of the front side 20 f 1 of the epitaxial layer, and a stem 33 formed on the support substrate 36 (the reverse face 20J2 of the epitaxial wafer 20 f). In the present embodiment a support substrate 36 that is not electroconductive is utilized, so the electrode 31 is formed on the epitaxial layer. Since the electrodes 31 and 32, and the stem 33 are the same as in Embodying Mode 6, their explanation will not be repeated.

In turn, a method of manufacturing the infrared LED 30 e in the present embodying mode will be made. To begin with, an epitaxial wafer 20 f is manufactured according to the Embodying-Mode 10 method of manufacturing an epitaxial wafer 20 fNext a portion of the Al_(x)Ga_((1-x))As layer 11 and the epitaxial layer is removed in such a way as to expose the epilayer 21 c 1 of polarity differing from that of the front side 20 f 1 of the epitaxial layer.

While the method of removal is not particularly limited, a technique such as, for example, etching in which photolithography is employed can be adopted.

Next the first electrode 32 is formed on the Al_(x)Ga_((1-x))As layer 11, and the second electrode 31 is formed on the epilayer 21 c 1 of polarity differing from that of the front side 20 f 1 of the epitaxial layer. The LED is then surface mounted. The aforedescribed steps make it possible to manufacture the infrared LED 30 e represented in FIG. 37.

It should be noted that in the present embodying mode, the stem 33 is formed on the support substrate 36 side of the epitaxial wafer 20 f, but is not limited to being in that configuration; the stem 33 may be formed on the Al_(x)Ga_((1-x))As layer 11 side as well.

As explained in the foregoing, in accordance with, in the present embodying mode, an infrared LED 30 e and method of its manufacture, a transparent adhesive material is utilized as the cement layer 35 to join the epitaxial layer and support substrate 36 together, and a transparent material transmitting 80% or more of light of wavelength of the optical emission from the active layer 21 is utilized for the support substrate 36. Consequently, if a form is adapted in which, though a reflecting structure is not provided on the gluing face (cement layer 35), the major surface of the support substrate 36 is fixed to the lead frame by means of a silver paste, light proceeding from the active layer 21 to the major-surface side of the support substrate 36 will be reflected by the silver paste, making it possible to heighten the light-output intensity. Accordingly, the output from the infrared LED 30 e can be further enhanced.

Embodiment 1

In the present embodiment, the effect of, in an Al_(x)Ga_((1-x))As layer 11, the amount fraction x of Al in the rear face 11 b being greater than the amount fraction x of Al in the major surface 11 a was investigated. Specifically, an Al_(x)Ga_((1-x))As substrate 10 a was manufactured in conformance with the Al_(x)Ga_((1-x))As substrate 10 a manufacturing method of Embodying Mode 1.

More particularly, GaAs substrates 13 were prepared (Step S1). Next, Al_(x)Ga_((1-x))As layers 11 having a variety of Al amount fractions x 0≦x≦1 were grown by LPE onto the GaAs substrates 13 (Step S2).

The transmissivity and surface oxygen quantity of the Al_(x)Ga_((1-x))As layers 11 when their emission wavelength was 850 nm, 880 nm and 940 nm were examined. In order to check these characteristics: The Al_(x)Ga_((1-x))As layer 11 of FIG. 1 was created at thicknesses of 80 μm to 100 μm, in such a way that the amount fraction of Al depth-wise would be uniform; the GaAs substrate 13 was removed as in the flow of FIG. 11; and with the layers in the FIG. 10 state, their transmissivity was measured with a transmittance meter. For the oxygen quantity: The same samples were created, in conformance with the flow in FIG. 14; epitaxial layers were grown by OMVPE; and, before the GaAs substrates 13 were removed, the major surface 11 a of the Al_(x)Ga_((1-x))As layers 11 was measured by secondary ion mass spectrometry (SIMS) characterization. The results are presented in FIG. 21 and FIG. 22.

In FIG. 21, the vertical axis indicates amount fraction x of Al in the Al_(x)Ga_((1-x))As layers 11, while the horizontal axis indicates transmissivity. The further to the right is the position along the axis in FIG. 21, the better is the transmissivity. Also, from looking at the implementations with which emission wavelength was 880 nm, it was understood that the transmissivity is favorable even with lower Al amount fraction levels. Furthermore, the implementations with which the emission wavelength was 940 nm allowed it to be confirmed that even with lower Al amount fraction levels, deterioration in transmissivity was unlikely to occur.

Next, in FIG. 22, the vertical axis indicates amount fraction x of Al in the Al_(x)Ga_((1-x))As layers 11, while the horizontal axis indicates surface oxygen quantity. The further to the left is the position along the axis in FIG. 22, the more favorable is the oxygen quantity. It will be understood that the surface oxygen quantity was the same when the emission wavelength was 850 nm, 880 nm and 940 nm.

Herein, in the present embodiment, as described above the Al_(x)Ga_((1-x))As layers 11 were created in such a way that the Al amount fraction depth-wise would be uniform, yet it was confirmed, by the same experiment described earlier, that because the oxygen quantity is determined principally by the amount fraction of Al in the major surface 11 a of the Al_(x)Ga_((1-x))As layers 11, even in instances in which the layer possesses a gradient in Al amount fraction, as illustrated in FIG. 2 through FIG. 5, the oxygen quantity's correlation with the Al amount fraction in the major surface is strong.

The same tendency holds true with respect to the transmissivity: In instances in which the layer possesses a gradient in Al amount fraction as illustrated in FIG. 2 through FIG. 5, the transmissivity is affected by the area where the Al amount fraction is lowest. Specifically, in implementations possessing a gradient as illustrated in FIG. 2 through FIG. 5, if the pattern of the gradient (layer number, gradient in each layer, thickness) and the gradient (

Al/distance) are the same, the correlation of the transmissivity to the size of the average Al amount fraction within the layer is strong.

It was recognized that, as shown in FIG. 21, the greater is the amount fraction x of Al in the Al_(x)Ga_((1-x))As layer 11, the more the transmissivity improves. Likewise, it was recognized that, as shown in FIG. 22, the lower is the amount fraction x of Al in the Al_(x)Ga_((1-x))As layer 11, the more the oxygen quantity contained in the major surface may be reduced.

From the foregoing, it was understood that according to the present embodiment, in the Al_(x)Ga_((1-x))As layers 11, raising the amount fraction x of Al in the rear face 11 b maintains a high level of transmissivity, while lowering the amount fraction x of Al in the major surface 11 a allows the oxygen quantity in the major surface to be reduced.

Embodiment 2

In the present embodiment, the effect of an Al_(x)Ga_((1-x))As layer 11 being furnished with a plurality of layers in each of which the amount fraction x of Al heading from the plane of the layer's rear face 11 b side to the plane of its major surface 11 a side monotonically decreases was investigated. Specifically, thirty-two different samples of Al_(x)Ga_((1-x))As substrate 10 a were manufactured in conformance with the method of manufacturing the Al_(x)Ga_((1-x))As substrate 10 a, depicted FIG. 1, in Embodying Mode 1.

More particularly, 2-inch and 3-inch GaAs substrates 13 were prepared (Step S1).

Next, Al_(x)Ga_((1-x))As layers 11 were grown by a slow-cooling technique (Step S2). In Step S2, the layers were grown so as to contain one or more laminae in each of which, as diagrammed in FIG. 2, the amount fraction x of Al constantly decreased heading in the growth direction. In detail, thirty-two different samples of Al_(x)Ga_((1-x))As layer 11 were grown in which the following parameters were as entered in the table below: the Al amount fraction x in the major surface 11 a of the Al_(x)Ga_((1-x))As layer 11 (minimum value of Al amount fraction x); in each lamina, the difference between the Al amount fraction x in the plane of the layer's rear face 11 b side and the Al amount fraction x in the plane of its major surface 11 a side (difference in Al amount fraction x); and number of laminae in each of which the amount fraction x of Al heading from the plane of the layer's rear face 11 b side to the plane of its major surface 11 a side monotonically decreased (laminae number). Thirty-two different samples of Al_(x)Ga_((1-x))As substrate 10 a were thereby manufactured.

With regard to the Al_(x)Ga_((1-x))As substrates 10 a themselves, warp appearing in an Al_(x)Ga_((1-x))As substrate 10 a—the gap between the Al_(x)Ga_((1-x))As substrate 10 a with its convexly deviating surface face up, and a planar block—was measured by employing a thickness gauge. The results are tabulated in Table I below. In Table I, instances in which warp occurring in an Al_(x)Ga_((1-x))As substrate 10 a was 200 μm or less when a 2-inch GaAs substrate was used, and was 300 μm or less when a 3-inch GaAs substrate was used are designated “∘,” while instances in which warp exceeded 200 μm when a 2-inch GaAs substrate was used, and exceeded 300 μm when a 3-inch GaAs substrate was used are designated “x.”

TABLE I Minimum Al amount Warp for each number of laminae Al amount fraction x 1 2 3 4 fraction x difference lamina laminae laminae laminae 0 ≦ x < 0.15 ∘ ∘ ∘ ∘ 0.1 to 0.3 0.15 ≦ x < 0.25 x ∘ ∘ ∘ 0.25 ≦ x < 0.35 x x ∘ ∘ 0.35 ≦ x x x x x 0.3 to 0.5 0 ≦ x < 0.15 ∘ ∘ ∘ ∘ 0.15 ≦ < 0.25 x ∘ ∘ ∘ 0.25 ≦ x < 0.35 x x ∘ ∘ 0.35 ≦ x x x x x

As is evident from Table I, regardless of the Al amount fraction x in the major surface 11 a, the smaller the difference in Al amount fraction x within the laminae where it monotonically decreases, the less likely warp was to occur in the Al_(x)Ga_((1-x))As substrates 10 a. It was understood that in instances in which the difference in Al amount fraction x was 0.15 or greater, but less than 0.35, warp could be mitigated by the Al_(x)Ga_((1-x))As layer 11 including numerous laminae with the monotonically decreasing amount fraction. From this result, it was inferred that in instances in which the difference in Al amount fraction x was a small 0.15 or less, increasing the number of laminae with the monotonically decreasing amount fraction would be efficacious if warp was to be further reduced. It was likewise inferred that in instances in which the difference in Al amount fraction x was 0.35 or greater, increasing to five or more the number of laminae in which x monotonically decreased would allow warp to be mitigated. It should be noted that there were no special differences between using 2-inch and 3-inch GaAs substrates.

As described in the foregoing, the present embodiment let it be confirmed that warp in the Al_(x)Ga_((1-x))As substrates 10 a can be mitigated by the Al_(x)Ga_((1-x))As layer 11 including a plurality of laminae in each of which the amount fraction x of Al heading from the plane of the layer's rear face 11 b side to the plane of its major surface 11 a side monotonically decreases.

Embodiment 3

In the present embodiment, the effect of an infrared-LED epitaxial wafer being furnished with an active layer having a multiquantum-well structure, as well as a satisfactory laminae number for the barrier layers and the well layers, was investigated.

In the present embodiment, four different samples, indicated in FIG. 23, of epitaxial wafers 40 were grown in which only the thickness of, and number of laminae in, the multiquantum-well-structure active layer 21 were varied.

Specifically, to begin with, GaAs substrates 13 were prepared (Step S1). Next, by OMVPE, an n-type cladding layer 41, an undoped guide layer 42, an active layer 21, an undoped guide layer 43, a p-type cladding layer 44, an Al_(x)Ga_((1-x))As layer 11, and a contact layer 23 were grown, in that order. The growth temperature for each layer was 750° C. The n-type cladding layers 41 had a thickness of 0.5 μm and consisted of Al_(0.35)Ga_(0.65)As; the undoped guide layers 42 had a thickness of 0.02 μm and consisted of Al_(0.30)Ga_(0.70)As; the undoped guide layers 43 had a thickness of 0.02 μm and consisted of Al_(0.30)Ga_(0.70)As; the p-type cladding layers 44 had a thickness of 0.5 μm and consisted of Al_(0.35)Ga_(0.65)As; the Al_(x)Ga_((1-x))As layers 11 had a thickness of 2 μm and consisted of p-type Al_(0.15)Ga_(0.85)As; and the contact layers 23 had a thickness of 0.01 μm and consisted of p-type GaAs. Furthermore, the active layers 21 were made to have optical emission wavelengths of from 840 nm to 860 nm, and were multiquantum-well (MQW) structures having two laminae, ten laminae, twenty laminae and fifty laminae of well layers and barrier layers, respectively. The well layers each had a thickness of 7.5 nm and consisted of GaAs, while the barrier layers each were laminae having a thickness of 5 nm and consisting of Al_(0.30)Ga_(0.70)As.

In addition, in the present embodiment a double-heterostructure epitaxial wafer, differing only in being furnished with an active layer composed solely of well layers whose emission wavelength was 870 nm and having a thickness of 0.5 μm, was grown as a separate epitaxial wafer for infrared LEDs.

As far as the respective grown epitaxial wafers are concerned, the epitaxial wafers were each manufactured without removing the GaAs substrate. Next, onto the contact layer 23, an electrode consisting of AuZn, and onto the n-type GaAs substrate 13, an electrode consisting of AuGe were respectively formed by vapor-deposition. Infrared LEDs were thereby obtained.

The light output of each infrared LED when a current of 20 mA was passed through it was measured with a constant-current source and a photometric instrument (integrating sphere). The results are diagrammed in FIG. 24. It should be noted that “DH” along the horizontal axis in FIG. 24 denotes an LED having a double heterostructure, “MQW” denotes LEDs furnished with well layers and barrier layers in an active layer, and the layer number denotes the laminae count of the well layers and of the barrier layers, respectively.

It was found that, as indicated in FIG. 24, compared with the LED having a double heterostructure, the LEDs furnished with an active layer having a multiquantum-well structure allowed the light output to be improved. In particular, it was understood that the LEDs with between ten and fifty (both inclusive) well layers and barrier layers led to dramatically improved light output.

Herein, in the present embodiment, the Al_(x)Ga_((1-x))As layers 11 were produced by OMVPE, but OMVPE requires an extraordinary amount of time in order to grow the Al_(x)Ga_((1-x))As layers 11 if their thickness is to be as great as in cases such as Embodiment 1. This point aside, the characteristics of the infrared LEDs created are the same as those of present-invention infrared LEDs wherein LPE and OMVPE were utilized, and thus for infrared LEDs of the present invention they do apply. It should be noted that in implementations in which the Al_(x)Ga_((1-x))As layer 11 thickness is large, utilizing LPE demonstrates the effect of making it possible to shorten the time needed in order to grow the Al_(x)Ga_((1-x))As layer 11.

In addition, in the present embodiment, as still another epitaxial wafer for infrared LEDs, epitaxial wafers of multiquantum-well structure (MQW), differing only in that their emission wavelength was 940 nm and in being furnished with an active layer containing well layers having InGaAs in the well laminae, were grown. With the InGaAs of the well laminae, the thickness was 2 nm to 10 nm and the amount fraction of 1 n consisted of 0.1 to 0.3. Meanwhile, the barrier layers consisted of Al_(0.30)Ga_(0.70)As.

Onto these epitaxial wafers also, in the same way as described above, electrodes were formed to create infrared LEDs. As to these infrared LEDs as well, the light output power was characterized in the same way as described above, with the result that light output powers whose emission wavelength was 940 nm were obtained.

Here, with respect to the barrier layers it has been confirmed by experimentation that even if they are anywhere from GaAs_(0.90)P_(0.10) to Al_(0.30)Ga_(0.70)As_(0.90)P_(0.10) they will have similar results. Further, the fact that the amount fraction of In and the amount fraction of P are adjustable at will has been confirmed by experimentation.

The foregoing allowed confirmation of utilizing as the active layer MQWs, with the well laminae being GaAs, in implementations in which the emission wavelength is to be between 840 nm and 890 nm both inclusive, and that a double heterostructure (DH) constituted from GaAs is applicable to implementations in which the emission wavelength is to be between 860 nm and 890 nm both inclusive. In addition, it could be confirmed that in implementations in which the emission wavelength is to be between 850 nm and 1100 nm both inclusive, it is possible to create the active layer from well layers constituted by InGaAs.

Embodiment 4

In the present embodiment, the effective range of thickness of the Al_(x)Ga_((1-x))As layer 11 in epitaxial wafers for infrared LEDs was investigated.

In the present embodiment, five different samples, indicated in FIG. 25, of epitaxial wafers 50 were grown in which only the thickness of the Al_(x)Ga_((1-x))As layer 11 was varied.

Specifically, to begin with, GaAs substrates 13 were prepared (Step S1). Next, by LPE, Al_(x)Ga_((1-x))As layers 11 having thicknesses of 2 um, 10 um, 20 um, 100 um, and 140 um, and constituted from p-type Al_(0.35)Ga_(0.65)As doped with Zn were respectively formed (Step S2). The LPE growth temperature at which the Al_(x)Ga_((1-x))As layers 11 were grown was 780° C., and the growth rate was an average 4 um/h. Next, using hydrochloric acid and sulfuric acid, the major surface 11 a of the Al_(x)Ga_((1-x))As layers 11 was washed (Step S3). Then major surface 11 a of the Al_(x)Ga_((1-x))As layers 11 was polished by means of chemical-mechanical planarization (Step S4). The major surface 11 a of the Al_(x)Ga_((1-x))As layers 11 was then washed using ammonia and hydrogen peroxide (Step S5). Next, by OMVPE, a p-type cladding layer 41, an undoped guide layer 42, an active layer 21, an undoped guide layer 43, an n-type cladding layer 44, and an n-type contact layer 23 were grown, in that order (Step S6). The OMVPE growth temperature for growing these layers was 750° C., while the growth rate was 1 to 2 um/h. Here the thicknesses and the materials (apart from the dopants) for the p-type cladding layer 41, the undoped guide layer 42, the undoped guide layer 43, the n-type cladding layer 44, and the n-type contact layer 23 were made the same as in Embodiment 3. Furthermore, active layers 21 having twenty laminae each of well layers and barrier layers were grown. The well layers each had a thickness of 7.5 nm and consisted of GaAs, while the barrier layers each were laminae having a thickness of 5 nm and consisting of Al_(0.30)Ga_(0.70)As.

Next, the GaAs substrate 13 was removed (Step S7). Infrared-LED epitaxial wafers furnished with Al_(x)Ga_((1-x))As layers having five different thicknesses were thereby manufactured.

Next, onto the contact layer 23, an electrode consisting of AuGe, and onto the rear face 11 b of the Al_(x)Ga_((1-x))As layer 11, an electrode consisting of AuZn were respectively formed by vapor-deposition. Infrared LEDs were thereby manufactured.

The light output of each of the infrared LEDs was measured in the same way as in Embodiment 3. The results are diagrammed in FIG. 26.

As indicated in FIG. 26, infrared LEDs furnished with an Al_(x)Ga_((1-x))As layer 11 having a thickness of between 20 μm and 140 μm both inclusive made it possible to improve light output significantly, while infrared LEDs furnished with an Al_(x)Ga_((1-x))As layer 11 having a thickness of between 100 μm and 140 μm both inclusive made possible extraordinarily large improvement in light output.

Now, with layer thicknesses under 20 μm, the fact that effectiveness from the GaAs substrate having been removed was not seen is believed, from luminescent image observations, to be because there was hardly any change in the extent of the emission surface area. That is because on account of the low mobility with a Zn-doped p-type Al_(x)Ga_((1-x))As layer 11, current does not diffuse. This can be remedied by having it be a Te-doped n-type Al_(x)Ga_((1-x))As layer 11 to raise the mobility. In below-described Embodiment 5, making the layers Te-doped was seen to broaden the luminescent image, improving the light output.

Embodiment 5

In the present embodiment, the effects from the fact that active-layer directed dispersion as caused by infrared LEDs of the present invention is low were investigated.

Sample 1

A Sample 1 epitaxial wafer for infrared LEDs was manufactured as follows. Specifically, at first a GaAs substrate 13 was prepared (Step S1). Next, by LPE, a Te-doped Al_(x)Ga_((1-x))As layer 11 having a thickness of 20 μm and constituted from n-type Al_(0.35)Ga_(0.65)As was grown (Step S2). Next, hydrochloric acid and sulfuric acid were employed to wash the major surface 11 a of the Al_(x)Ga_((1-x))As layer 11 (Step S3). Subsequently, the major surface 11 a of the Al_(x)Ga_((1-x))As layer 11 was polished by means of chemical-mechanical planarization (Step S4). Ammonia and hydrogen peroxide were employed then to wash the major surface 11 a of the Al_(x)Ga_((1-x))As layer 11 (Step S5). Next, by OMVPE, an Si-doped n-type cladding layer 41, an undoped guide layer 42, an active layer 21, an undoped guide layer 43, a Zn-doped p-type cladding layer 44, and a p-type contact layer 23 were grown, in that order (Step S6), as illustrated in FIG. 25. Here the thicknesses of, and the materials apart from the dopants for, the n-type cladding layer 41, the undoped guide layer 42, the undoped guide layer 43, and the p-type cladding layer 44 were made the same as in Embodiment 3. In addition, an active layer 21 having twenty laminae each of well layers and barrier layers was grown. The well layers each were laminae having a thickness of 7.5 nm and consisting of GaAs, while the barrier layers each were laminae having a thickness of 5 nm and consisting of Al_(0.30)Ga_(0.70)As. Also, the growth temperatures and growth rates in the LPE and OMVPE were made the same as in Embodiment 4.

The GaAs substrate 13 was then removed (Step S7). A Sample 1 infrared-LED epitaxial wafer was thereby manufactured.

Next, onto the p-contact layer 23, an electrode consisting of AuZn, and onto the bottom of the Al_(x)Ga_((1-x))As layer 11, an electrode consisting of AuGe were respectively formed by vapor-deposition (Step S11). An infrared LED was thereby manufactured.

Sample 2

For Sample 2, to begin with a GaAs substrate 13 was prepared (Step S1). Next, by OMVPE, a p-type cladding layer 44, an undoped guide layer 43, an active layer 21, an undoped guide layer 42, and an n-type cladding layer 41 were grown, in that order, in the same manner as with Sample 1. Next, an Al_(x)Ga_((1-x))As layer 11 was formed by LPE. The thickness of and material constituting the Al_(x)Ga_((1-x))As layer 11 was made the same as with Sample 1.

Next, likewise as with Sample 1, the GaAs substrate 13 was removed, producing a Sample 2 infrared-LED epitaxial wafer.

Next, electrodes were formed onto the front and back sides of the epitaxial wafer in the same manner as with Sample 1, producing a Sample 2 infrared LED.

Measurement Method

The Zn diffusion length in, and the light output from, Samples 1 and 2 were measured. Specifically, the Zn concentration in the interface between the active layer and the guide layers was characterized by SIMS, and additionally, the position in the active layer where the Zn concentration fell to 1/10 or less was measured by SIMS, and the distance into the active layer from the interface between the active layer and the guide layers was taken as the Zn diffusion length. Here too the light output was measured in the same way as in Embodiment 3. The results are set forth in Table II below.

TABLE II Zn diffusion Zn max. conc. inside Light length (μm) active layer (cm⁻³) output (mW) Pres. invent. ex. 0 6.0 × 10¹⁵ 1.3 Comp. ex. 0.3 6.0 × 10¹⁷ 0.62

Measurement Results

As indicated in Table II, with Sample 1, in which the active layer was grown by OMVPE after the Al_(x)Ga_((1-x))As layer 11 had been grown by LPE, the Zn doped into the Al_(x)Ga_((1-x))As 11, formed ahead of the active layer, could be prevented from diffusing inside the active layer, and the Zn concentration within the active layer 21 could be reduced. As a result, the light output from the Sample 1 infrared LED could be dramatically improved over that from Sample 2.

The foregoing allowed it to be confirmed that in accordance with the present invention, forming the active-layer-incorporating epitaxial layer (Step S7) after the Al_(x)Ga_((1-x))As layer 11 has been formed by LPE (Step S2) enables the light output to be improved.

Embodiment 6

In the present embodiment, the effectiveness with which an infrared LED of 900 nm or greater wavelength could be fabricated was examined.

In the present embodiment, an infrared LED was manufactured in the same way as with the infrared LED manufacturing method of Embodiment 4, while differing only in terms of the active layer 21. Specifically, in the present embodiment, an active layer 21 having 20 laminae of, respectively, well layers each having a thickness of 6 nm and consisting of In_(0.12)Ga_(0.88)As and barrier layers each having a thickness of 12 nm and consisting of GaAs_(0.9)P_(0.1) was grown.

The emission spectrum for this infrared LED was characterized. The result is graphed in FIG. 38. As indicated in FIG. 38, it could be confirmed that the manufacture of an infrared LED of 940 nm emission wavelength was possible.

Embodiment 7

In the present embodiment, the conditions for an epitaxial wafer to be utilized in an infrared LED of 900 nm or greater emission wavelength were examined.

Present Invention Examples 1 through 4

The infrared LEDs of Present Invention Examples 1 through 4 were manufactured in the same way as with the infrared LED manufacturing method of Embodiment 6, while differing only in terms of the Al_(x)Ga_((1-x))As layer 11 and the active layer 21. Specifically, the average amount fraction of Al in the Al_(x)Ga_((1-x))As layers 11 was made to be as set forth in Table III below. The Al amount fraction in the major surface and in the rear face of the Al_(x)Ga_((1-x))As layers 11 was, to cite single instances in the order (rear face, major surface): for 0.05, (0.10, 0.01); for 0.15, (0.25, 0.05); for 0.25, (0.35, 0.15); and for 0.35, (0.40, 0.30). The average Al amount fraction and the amount fraction in the (rear face, major surface) are, however, adjustable at will. Here, the amount fraction of Al monotonically decreased heading from the rear face to the major surface of the Al_(x)Ga_((1-x))As layers 11. And for the active layer 21 in these cases, an active layer 21 having 5 laminae of, respectively, well layers each consisting of InGaAs and barrier layers each consisting of GaAs was grown. The infrared LEDs had an emission wavelength of 890 nm.

Present Invention Examples 5 through 8

The infrared LEDs of Present Invention Examples 5 through 8 were manufactured in the same way as with the infrared LED manufacturing method of Present Invention Examples 1 through 4, while differing in that the emission wavelength was 940 nm.

Comparative Examples 1 and 2

The infrared LEDs of Comparative Examples 1 and 2 were manufactured similarly as with the infrared LEDs of Present Invention Examples 1 through 4 and Present Invention Examples 5 through 8, respectively, but differed in not being furnished with an Al_(x)Ga_((1-x))As layer 11. That is, an Al_(x)Ga_((1-x))As layer 11 was not formed, nor was the GaAs substrate removed.

Measurement Method

Lattice relaxation with regard to the infrared LEDs of Present Invention Examples 1 through 8 and Comparative Examples 1 and 2 was determined. The lattice relaxation was characterized by photoluminescence spectroscopy, x-ray diffraction, and visual inspection of the surface. When the lattice-relaxed epitaxial wafers were fabricated into infrared LEDs, they were verified as such by dark lines. Furthermore, the light output power of the infrared LEDs of Present Invention Examples 1 through 8 and Comparative Examples 1 and 2 was measured in the same way as in Embodiment 3. The results are set forth in Table III below.

TABLE III Substrate Active layer Light Al amt. Number Lattice Emission output Material fract. Composition laminae relax. wvlng. power Pres. Inv. Ex. 1 AlGaAs 0.05 InGaAs/GaAs 5 Absent 890 nm 5 mW Pres. Inv. Ex. 2 AlGaAs 0.15 InGaAs/GaAs 5 Absent 890 nm 6 mW Pres. Inv. Ex. 3 AlGaAs 0.25 InGaAs/GaAs 5 Absent 890 nm 6 mW Pres. Inv. Ex. 4 AlGaAs 0.35 InGaAs/GaAs 5 Absent 890 nm 6 mW Comp. Ex. 1 GaAs — InGaAs/GaAs 5 Absent 890 nm 1.5 mW Pres. Inv. Ex. 5 AlGaAs 0.05 InGaAs/GaAs 5 Pres. 940 nm 2 mW Pres. Inv. Ex. 6 AlGaAs 0.15 InGaAs/GaAs 5 Pres. 940 nm 3 mW Pres. Inv. Ex. 7 AlGaAs 0.25 InGaAs/GaAs 5 Pres. 940 nm 3.5 mW Pres. Inv. Ex. 8 AlGaAs 0.35 InGaAs/GaAs 5 Pres. 940 nm 3.5 mW Comp. Ex. 2 GaAs — InGaAs/GaAs 5 Absent 940 nm 1.5 mW

As indicated in Table III, in the infrared LEDs whose emission wavelength was 890 nm, there was no lattice relaxation (lattice misalignment), regardless of whether the substrate was a GaAs substrate or an Al_(x)Ga_((1-x))As layer. Likewise, in the infrared LED of Comparative Example 2, made from a GaAs substrate alone, there was no lattice relaxation, despite the emission wavelength being 940 nm. In the infrared LEDs of Present Invention Examples 5 through 8, however, which were furnished with an Al_(x)Ga_((1-x))As layer 11 as an Al_(x)Ga_((1-x))As substrate and which had an emission wavelength of 940 nm, there was lattice relaxation. Thus, with infrared LEDs furnished with an Al_(x)Ga_((1-x))As layer 11 as an Al_(x)Ga_((1-x))As substrate, whereas the output power of the infrared LEDs in which there was no lattice relaxation was 5 mW to 6 mW, the output power of the infrared LEDs in which there was lattice relaxation was a low 2 to 3.5 mW, wherein it was understood that inconsistencies within the surface of the same wafer are considerable. More particularly, the measurement inconsistencies were in wafers having a 2- to 4-inch φ wafer diameter.

From these facts it was understood that technology that can be applied on GaAs substrates cannot be applied to epitaxial wafers that are utilized in infrared LEDs whose emission wavelength is 900 nm or greater.

Therein, the present inventors devoted research, as discussed below, to investigating the conditions whereby lattice relaxation is curbed in epitaxial wafers that are utilized in infrared LEDs whose emission wavelength is 900 nm or greater.

Specifically, in the following way, infrared LEDs of Present Invention Examples 9 through 24 and Comparative Examples 3 through 6, in which the emission wavelength was 940 nm, were manufactured.

Present Invention Examples 9 through 12

The infrared LEDs of Present Invention Examples 9 through 12 basically were manufactured in the same way as with the infrared LEDs of Present Invention Examples 5 through 8, while differing in that the number of well layers and barrier layers, respectively, each was made three laminae. The In amount fraction in the well layers was 0.12.

Present Invention Examples 13 through 16

The infrared LEDs of Present Invention Examples 13 through 16 basically were manufactured in the same way as with the infrared LEDs of Present Invention Examples 5 through 8, while differing in having the barrier layers be GaAsP, and in making the number of well layers and barrier layers each be three laminae. The P amount fraction in the barrier layers was 0.10.

Present Invention Examples 17 through 20

The infrared LEDs of Present Invention Examples 17 through 20 basically were manufactured in the same way as with the infrared LEDs of Present Invention Examples 13 through 16, while differing in that the number of well layers and barrier layers each was made be ten laminae.

Present Invention Examples 21 through 24

The infrared LEDs of Present Invention Examples 21 through 24 basically were manufactured in the same way as with the infrared LEDs of Present Invention Examples 5 through 8, while differing in having the barrier layers be AlGaAsP, and in making the number of well layers and of barrier layers each be twenty laminae. The P amount fraction in the barrier layers was 0.10.

Comparative Examples 3 through 6

The infrared LEDs of Comparative Example 3 basically were manufactured in the same way as with the infrared LEDs of, respectively, Present Invention Examples 9 through 12, Present Invention Examples 13 through 16, Present Invention Examples 17 through 20, and Present Invention Examples 21 through 24, while differing in that a GaAs substrate not furnished with an Al_(x)Ga_((1-x))As layer as an Al_(x)Ga_((1-x))As substrate was employed.

Measurement Method

In the same manner as with the methods explained above, the lattice relaxation and light output power were determined. The results are set forth in Table IV below.

TABLE IV Substrate Active layer Light Al amt. Number Lattice output Material fract. Composition laminae relax. power Pres. Inv. Ex. 9 AlGaAs 0.05 InGaAs/GaAs 3 Absent 6 mW Pres. Inv. Ex. 10 AlGaAs 0.15 InGaAs/GaAs 3 Absent 6 mW Pres. Inv. Ex. 11 AlGaAs 0.25 InGaAs/GaAs 3 Absent 6 mW Pres. Inv. Ex. 12 AlGaAs 0.35 InGaAs/GaAs 3 Absent 6 mW Comp. Ex. 3 GaAs — InGaAs/GaAs 3 Absent 1.5 mW Pres. Inv. Ex. 13 AlGaAs 0.05 InGaAs/GaAsP 3 Absent 6 mW Pres. Inv. Ex. 14 AlGaAs 0.15 InGaAs/GaAsP 3 Absent 6 mW Pres. Inv. Ex. 15 AlGaAs 0.25 InGaAs/GaAsP 3 Absent 6 mW Pres. Inv. Ex. 16 AlGaAs 0.35 InGaAs/GaAsP 3 Absent 6 mW Comp. Ex. 4 GaAs — InGaAs/GaAsP 3 Absent 1.5 mW Pres. Inv. Ex. 17 AlGaAs 0.05 InGaAs/GaAsP 10 Absent 6 mW Pres. Inv. Ex. 18 AlGaAs 0.15 InGaAs/GaAsP 10 Absent 6 mW Pres. Inv. Ex. 19 AlGaAs 0.25 InGaAs/GaAsP 10 Absent 6 mW Pres. Inv. Ex. 20 AlGaAs 0.35 InGaAs/GaAsP 10 Absent 6 mW Comp. Ex. 5 GaAs — InGaAs/GaAsP 10 Absent 1.5 mW Pres. Inv. Ex. 21 AlGaAs 0.05 InGaAs/AlGaAsP 20 Absent 6 mW Pres. Inv. Ex. 22 AlGaAs 0.15 InGaAs/AlGaAsP 20 Absent 6 mW Pres. Inv. Ex. 23 AlGaAs 0.25 InGaAs/AlGaAsP 20 Absent 6 mW Pres. Inv. Ex. 24 AlGaAs 0.35 InGaAs/AlGaAsP 20 Absent 6 mW Comp. Ex. 6 GaAs — InGaAs/AlGaAsP 20 Absent 1.5 mW

Measurement Results

As indicated in Table IV, with Present Invention Examples 9 through 12, which included InGaAs wherein the well layers inside the active layer 21 contained In, and whose number of well layers was four laminae or fewer, lattice relaxation did not occur.

Likewise, with Present Invention Examples 13 through 24, which included either GaAsP or AlGaAsP wherein the barrier layers inside the active layer contained P, and whose number of barrier layers was three laminae or more, lattice relaxation did not occur.

From the foregoing, according to the present embodiments, it was discovered that in epitaxial wafers utilized in infrared LEDs whose emission wavelength is 900 nm or greater, lattice misalignment can be controlled to a minimum in instances where the well layers inside the active layer include a material containing In, and the number of well layers is four or fewer laminae, as well as in instances where the barrier layers inside the active layer include a material containing P and the number of barrier layers is three or more laminae.

The presently disclosed embodying modes and embodiment examples should in all respects be considered to be illustrative and not limiting. The scope of the present invention is set forth not by the embodying modes described in the foregoing, but by the scope of the patent claims, and is intended to include meanings equivalent to the scope of the patent claims and all modifications within the scope.

Reference Signs List

10 a, 10 b: Al_(x)Ga_((1-x))As substrate; 11: Al_(x)Ga_((1-x))As layer; 11 a, 13 a, 21, 21 a 1: major surface; 11 b, 13 b, 20 c 2, 20 d 2, 20 e 2, 20 f 2, 21 b 1, 21 c: rear face; 13: GaAs substrate; 20 a, 20 b, 20 c, 20 d, 20 e, 20 f, 40, 50: epitaxial wafer; 20 c 1, 20 d 1, 20 e 1, 20 f 1: front side; 21: active layer; 21 a: well layers; 21 b: barrier layers; 21 c 1: epilayer; 23: contact layer; 25, 35: cement layer; 26, 36: support substrate; 27: electroconductive layer; 28: reflective layer; 30 a, 30 b, 30 c, 30 d, 30 e: LEDs; 31, 32: electrodes; 33: stem; 41, 44: cladding layers; 42, 43: undoped guide layers. 

1. An Al_(x)Ga_((1-x))As substrate furnished with an Al_(x)Ga_((1-x))As layer (0≦x≦1) having a major surface and, on the reverse side from the major surface, a rear face; the Al_(x)Ga_((1-x))As substrate characterized in that: in said Al_(x)Ga_((1-x))As layer, the amount fraction x of Al in the rear face is greater than the amount fraction x of Al in the major surface.
 2. The Al_(x)Ga_((1-x))As substrate set forth in claim 1, wherein: said Al_(x)Ga_((1-x))As layer contains a plurality of laminae; and the amount fraction x of Al in each of the plural laminae monotonically decreases heading from the plane of the layer's rear-face side to the plane of its major-surface side.
 3. The Al_(x)Ga_((1-x))As substrate set forth in claim 1, further furnished with a GaAs substrate contacting the rear face of said Al_(x)Ga_((1-x))As layer.
 4. An epitaxial wafer for infrared LEDs, furnished with: the Al_(x)Ga_((1-x))As substrate set forth in claim 1; and an epitaxial layer formed onto the major surface of said Al_(x)Ga_((1-x))As layer, and including an active layer.
 5. The infrared-LED epitaxial wafer set forth in claim 4, wherein the amount fraction x of Al in the epitaxial layer plane of contact with said Al_(x)Ga_((1-x))As layer is greater than the amount fraction x of Al in the Al_(x)Ga_((1-x))As layer plane of contact with said epitaxial layer.
 6. An epitaxial wafer for infrared LEDs, furnished with: the Al_(x)Ga_((1-x))As substrate set forth in claim 1; an epitaxial layer formed onto the major surface of said Al_(x)Ga_((1-x))As layer, and including an active layer; a cement layer formed onto the major surface of said epitaxial layer, on the reverse side thereof from its plane of contact with said Al_(x)Ga_((1-x))As layer; and a support substrate joined, via said cement layer, to the major surface of said epitaxial layer.
 7. The infrared-LED epitaxial wafer set forth in claim 6, wherein said cement layer and said support substrate are materials that are electroconductive.
 8. The infrared-LED epitaxial wafer set forth in claim 6, wherein said support substrate is constituted from matter containing at least one substance selected from the group consisting of silicon, gallium arsenide, and silicon carbide.
 9. The infrared-LED epitaxial wafer set forth in claim 6, further furnished with an electroconductive layer and a reflective layer, formed in between said cement layer and said epitaxial layer; wherein: said electroconductive layer is transparent with respect to the light that said active layer emits; and said reflective layer is made from a metallic material that reflects light.
 10. The infrared-LED epitaxial wafer set forth in claim 9, wherein said electroconductive layer is constituted from matter containing at least one substance selected from the group consisting of mixtures of indium oxide and tin oxide, zinc oxide containing aluminum atoms, tin oxide containing fluorine atoms, zinc oxide, zinc selenide, and gallium oxide.
 11. The infrared-LED epitaxial wafer set forth in claim 9, wherein said reflective layer is constituted from matter containing at least one substance selected from the group consisting of aluminum, gold, platinum, silver, copper, chrome, and palladium.
 12. The infrared-LED epitaxial wafer set forth in claim 6, wherein said cement layer is adhesive with respect to said epitaxial layer and said support substrate, and is a transparent adhesive material that transmits the light that said active layer emits.
 13. The infrared-LED epitaxial wafer set forth in claim 12, wherein said cement layer is constituted from matter containing at least one substance selected from the group consisting of polyimide resins, epoxy resins, silicone resins, and perfluorocyclobutane.
 14. The infrared-LED epitaxial wafer set forth in claim 12, wherein said support substrate is a transparent baseplate that transmits the light that said active layer emits.
 15. The infrared-LED epitaxial wafer set forth in claim 14, wherein said support substrate is constituted from matter containing at least one substance selected from the group consisting of sapphire, gallium phosphide, quartz and spinel.
 16. An infrared LED furnished with: the epitaxial wafer set forth in claim 6; a first electrode formed on the Al_(x)Ga_((1-x))As substrate; and a second electrode formed on either said support substrate or said epitaxial layer.
 17. An infrared LED furnished with: the Al_(x)Ga_((1-x))As substrate set forth in claim 1; an epitaxial layer formed onto the major surface of said Al_(x)Ga_((1-x))As layer, and including an active layer; a first electrode formed superficially on said epitaxial layer; and a second electrode formed on the rear face of said Al_(x)Ga_((1-x))As layer.
 18. An infrared LED furnished with: the Al_(x)Ga_((1-x))As substrate set forth in claim 3; an epitaxial layer formed onto the major surface of said Al_(x)Ga_((1-x))As layer, and including an active layer; a first electrode formed superficially on said epitaxial layer; and a second electrode formed on said GaAs substrate, on its rear face.
 19. An Al_(x)Ga_((1-x))As substrate manufacturing method provided with: a step of preparing a GaAs substrate; and a step of growing, by LPE, onto the GaAs substrate an Al_(x)Ga_((1-x))As layer (0≦x≦1) having a major surface; characterized in that in said Al_(x)Ga_((1-x))As layer growing step, the Al_(x)Ga_((1-x))As layer is grown with the amount fraction x of Al in the interface between the layer and the GaAs substrate being greater than the amount fraction x of Al in the major surface.
 20. The Al_(x)Ga_((1-x))As substrate manufacturing method set forth in claim 19, wherein in said step of growing an Al_(x)Ga_((1-x))As layer, the Al_(x)Ga_((1-x))As layer is grown containing a plurality of laminae in which the amount fraction x of Al monotonically decreases heading from the plane along the layer's interface with the GaAs substrate to the plane of the layer's major-surface side.
 21. The Al_(x)Ga_((1-x))As substrate manufacturing method set forth in claim 19, further provided with a step of removing said GaAs substrate.
 22. A method of manufacturing an epitaxial wafer for infrared LEDs, provided with: a step of manufacturing an Al_(x)Ga_((1-x))As substrate by the Al_(x)Ga_((1-x))As substrate manufacturing method set forth in any of claim 19; and a step of forming onto the major surface of said Al_(x)Ga_((1-x))As layer, by at least either OMVPE or MBE, an epitaxial layer containing an active layer.
 23. The infrared-LED epitaxial wafer manufacturing method set forth in claim 22, wherein the amount fraction x of Al in the epitaxial layer plane of contact with said Al_(x)Ga_((1-x))As layer is greater than the amount fraction x of Al in the Al_(x)Ga_((1-x))As layer plane of contact with said epitaxial layer.
 24. A method of manufacturing an infrared LED, provided with: a step of manufacturing an Al_(x)Ga_((1-x))As substrate by the Al_(x)Ga_((1-x))As substrate manufacturing method set forth in claim 19; a step of forming onto the major surface of the Al_(x)Ga_((1-x))As layer, by either OMVPE or MBE, an epitaxial layer containing an active layer, to yield an epitaxial wafer; a step of forming a first electrode superficially on the epitaxial wafer; and a step of forming a second electrode on rear face of the GaAs substrate.
 25. A method of manufacturing an infrared LED, provided with: a step of manufacturing an Al_(x)Ga_((1-x))As substrate by the Al_(x)Ga_((1-x))As substrate manufacturing method set forth in claim 21; a step of forming onto the major surface of the Al_(x)Ga_((1-x))As layer, by either OMVPE or MBE, an epitaxial layer containing an active layer, to yield an epitaxial wafer; a step of forming a first electrode superficially on the epitaxial wafer; and a step of forming a second electrode on rear face of the Al_(x)Ga_((1-x))As layer.
 26. An infrared-LED epitaxial wafer manufacturing method provided with: a step of manufacturing an Al_(x)Ga_((1-x))As substrate by the Al_(x)Ga_((1-x))As substrate manufacturing method set forth in claim 19; a step of forming onto the major surface of the Al_(x)Ga_((1-x))As layer, by at least either OMVPE or MBE, an epitaxial layer containing an active layer; a step of bonding, via a cement layer, a major surface of the epitaxial layer, on the reverse side thereof from its plane of contact with the Al_(x)Ga_((1-x))As layer, together with a support substrate; and a step of removing the GaAs substrate.
 27. The infrared-LED epitaxial wafer manufacturing method set forth in claim 26, wherein the cement layer and the support substrate are materials that are electroconductive.
 28. The infrared-LED epitaxial wafer manufacturing method set forth in claim 26, wherein the support substrate is constituted from matter containing at least one substance selected from the group consisting of silicon, gallium arsenide, and silicon carbide.
 29. The infrared-LED epitaxial wafer manufacturing method set forth in claim 26, further furnished with a step of forming an electroconductive layer and a reflective layer, in between the cement layer and the epitaxial layer; wherein the electroconductive layer is transparent with respect to the light that the active layer emits; and the reflective layer is made from a metallic material that reflects light.
 30. The infrared-LED epitaxial wafer manufacturing method set forth in claim 29, wherein the electroconductive layer is constituted from matter containing at least one substance selected from the group consisting of mixtures of indium oxide and tin oxide, zinc oxide containing aluminum atoms, tin oxide containing fluorine atoms, zinc oxide, zinc selenide, and gallium oxide.
 31. The infrared-LED epitaxial wafer manufacturing method set forth in claim 29, wherein the reflective layer is constituted from matter containing at least one substance selected from the group consisting of aluminum, gold, platinum, silver, copper, chrome, and palladium.
 32. The infrared-LED epitaxial wafer manufacturing method set forth in claim 26, wherein the cement layer is adhesive with respect to the epitaxial layer and the support substrate, and is a transparent adhesive material that transmits the light that the active layer emits.
 33. The infrared-LED epitaxial wafer manufacturing method set forth in claim 32, wherein the cement layer is constituted from matter containing at least one substance selected from the group consisting of polyimide resins, epoxy resins, silicone resins, and perfluorocyclobutane.
 34. The infrared-LED epitaxial wafer manufacturing method set forth in claim 32, wherein the support substrate is a transparent baseplate that transmits the light that the active layer emits.
 35. The infrared-LED epitaxial wafer manufacturing method set forth in claim 34, wherein the support substrate is constituted from matter containing at least one substance selected from the group consisting of sapphire, gallium phosphide, quartz and spinel.
 36. An infrared LED manufacturing method furnished with: a step of manufacturing an epitaxial wafer by the epitaxial-wafer manufacturing method set forth in claim 26; a step of forming a first electrode on the Al_(x)Ga_((1-x))As substrate; and a step of forming a second electrode on either the support substrate or the epitaxial layer. 